Multi-Layer Electrode Structure for Laser Lift-Off Signal Reliability
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Solution Overview
Problem
Existing electronic devices face challenges in maintaining reliable signal transmission due to deformation and fracture issues during the laser lift-off process, which can compromise the integrity of the substrate and metal layers, leading to ineffective electrode signal transmission.
Innovation Solution
Incorporating a metal layer between the substrate and conductive layers, with specific design features such as protruding structures and multiple overlapping metal layers to enhance ductility and provide redundant signal paths, thereby preventing fractures and ensuring continuous signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal layer is used to transmit signals in the electronic device, then signal transmission capability is improved, but the metal layer becomes susceptible to deformation and fracture during laser lift-off process
Solution Approach 1:
The metal layer is divided into multiple separate metal layers, each with different thicknesses and positions. This segmentation allows each layer to contribute differently to signal transmission while reducing the overall brittleness and deformation risk of the metal structure during laser lift-off process.
Solution Approach 2:
The patent changes the physical parameters of the metal layers by creating multiple layers with varying thicknesses (first metal layer with first thickness, second metal layer with second thickness). This parameter variation optimizes both signal transmission capability and mechanical robustness during processing.
2Ease of manufacture
If the electronic device structure is simplified to reduce manufacturing complexity, then ease of manufacture is improved, but signal transmission reliability deteriorates due to lack of redundant paths
Solution Approach 1:
The metal layers are pre-configured with specific thickness variations and positional arrangements before the laser lift-off process. This preliminary structuring ensures that during signal transmission, redundant paths are already in place, allowing the system to maintain reliability without adding complex real-time switching mechanisms.
Solution Approach 2:
The patent uses composite metal layer structures with different thicknesses and materials properties to achieve both manufacturing feasibility and signal transmission reliability. The composite structure provides mechanical strength for easy handling while maintaining electrical conductivity for reliable signal transmission.
3Reliability
If the metal layer thickness is increased to improve signal transmission, then electrical conductivity is improved, but susceptibility to deformation and fracture during laser lift-off increases
Solution Approach 1:
Instead of using a single thick metal layer that is prone to deformation, the patent segments the metal structure into multiple thinner layers. Each layer contributes to signal transmission while the distributed structure reduces stress concentration and deformation risk during laser lift-off process.
Solution Approach 2:
The patent optimizes the thickness parameter of metal layers by creating a distribution of thicknesses rather than using uniform thickness. This parameter optimization balances electrical conductivity requirements with mechanical robustness during processing, ensuring reliable signal transmission without excessive deformation risk.
Data Source
AI summary
An electronic device includes: a substrate having a surface; a first layer disposed on the surface; a second layer and a protruding structure disposed on the first layer; and a third layer disposed in a peripheral area between the substrate and a portion of the first layer. The portion of the first layer and the second layer are configured to transmit a signal. A first distance between the surface and a top surface of the first layer is less than a second distance between the surface and a top surface of the protruding structure along a normal direction of the substrate. The second distance is less than a third distance between the surface and a top surface of the second layer along the normal direction. The third layer is overlapped with the second layer and electrically connected to the second layer and the portion of the first layer.