Multilayer Electronic Component Electrode for Lifting Defect Prevention
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Solution Overview
Problem
Conductive resin layers in multilayer ceramic capacitors experience lifting defects and reduced electrical connectivity due to outgassing and Sn elution, which are exacerbated in high-temperature environments, affecting the reliability and plating properties of the components.
Innovation Solution
Incorporating a specific ratio of Cu3Sn and Cu6Sn5 intermetallic compounds in the conductive resin layer, ranging from 1.88% to 38.89% for Cu3Sn and 31.54% to 97.23% for Cu6Sn5, to enhance electrical connectivity and prevent lifting defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conductive resin layer is applied to protect the multilayer ceramic capacitor from tensile stress, then mechanical protection is improved, but lifting defects occur at the interface between the sintered electrode layer and resin electrode layer due to out gas generated in the conductive resin layer
Solution Approach 1:
The patent changes the compositional parameters of the conductive resin layer by incorporating specific intermetallic compounds (Cu3Sn and Cu6Sn5) in controlled ratios. This modifies the thermal and mechanical properties of the resin layer, reducing outgas generation during reflow processing while maintaining mechanical protection capabilities.
Solution Approach 2:
The patent creates a composite conductive resin layer by combining resin material with conductive particles and intermetallic compounds (Cu3Sn and Cu6Sn5). This composite structure provides both mechanical protection and reduced outgas emission, resolving the contradiction between strength and reliability.
2Reliability
If a conductive resin layer with dispersed conductive metal particles is used, then electrical connectivity is achieved through hopping conduction, but the electrical connectivity is lower than that of the sintered electrode layer
Solution Approach 1:
The patent changes the electrical parameters of the conductive resin layer by incorporating intermetallic compounds with higher conductivity than the base resin matrix. The specific ratios of Cu3Sn and Cu6Sn5 are optimized to enhance electrical connectivity while maintaining the manufacturability of the conductive resin layer.
Solution Approach 2:
The patent develops a composite conductive resin layer that combines resin, conductive metal particles, and intermetallic compounds. This composite structure achieves improved electrical connectivity through the synergistic effect of hopping conduction in the resin matrix and higher conductivity pathways provided by the intermetallic compounds.
3Reliability
If intermetallic compounds such as Cu3Sn and Cu6Sn5 are included in the conductive resin layer to prevent lifting defects, then interface bonding is improved, but it is necessary to appropriately adjust the presence ratio of Cu3Sn and Cu6Sn5
Solution Approach 1:
The patent optimizes the compositional parameters by specifying precise ratio ranges for Cu3Sn and Cu6Sn5 intermetallic compounds in the conductive resin layer. This parameter control ensures improved interface bonding while providing clear manufacturing guidelines to manage composition complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents lifting defects and improves electrical connectivity, ensuring the reliability and plating properties of multilayer ceramic capacitors by controlling the intermetallic compound ratios in the conductive resin layer.
Implementation Method 1
a conductive resin layer is present in a form in which conductive metal particles are dispersed in a resin, and secures electrical connectivity through hopping conduction
Data Source
AI summary
An example embodiment of the present disclosure provides a multilayer electronic component including an external electrode including an electrode layer and a conductive resin layer disposed on the electrode layer. The conductive resin layer includes conductive particles including at least one of Cu particles, Cu3Sn and Cu6Sn5, and a resin, and in cross-sections of the conductive resin layer, a ratio of an area occupied by Cu3Sn to the total area occupied by the Cu particles, Cu3Sn, and Cu6Sn5 is 1.88% to 38.89%, and a ratio of an area occupied by Cu6Sn5 to the total area occupied by the Cu particles, Cu3Sn and Cu6Sn5 is 31.54% to 97.23%.