Multilayer electronic component with improved reliability
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in achieving miniaturization, high capacitance, and reliability due to moisture and plating solution permeation, which deteriorate their performance in limited board space.
Innovation Solution
A multilayer electronic component design with thinner dielectric, internal, and external electrodes, along with insulating and plating layers, is implemented to prevent moisture and plating solution permeation, ensuring improved reliability and reduced mounting space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of laminated layers is decreased to achieve miniaturization and high capacitance, then capacitance per unit volume is improved, but the margin thickness is decreased which facilitates permeation of external moisture or plating solution and deteriorates reliability
Solution Approach 1:
The patent applies preliminary action by forming the insulating layer and plating layers on the external electrodes before the component is exposed to moisture or plating solutions. This pre-established protective barrier prevents harmful permeation from occurring in the first place, addressing the reliability issue before it can manifest during operation or manufacturing.
Solution Approach 2:
The insulating layer and plating layer act as intermediary protective barriers between the external electrodes and the harmful external environment (moisture and plating solutions). These intermediate layers mediate the interaction by blocking harmful substances from reaching the internal electrodes and dielectric layers, thus preventing permeation without requiring changes to the core capacitor structure.
2Volume of moving object
If the number of laminated layers is decreased to achieve miniaturization, then mounting space is reduced, but the component requires protective layers to prevent permeation which may increase complexity
Solution Approach 1:
The patent merges multiple protective functions into a single integrated layering system. The insulating layer and plating layer are combined to simultaneously provide both electrical insulation and corrosion/moisture protection, eliminating the need for separate protective structures and reducing overall device complexity while maintaining miniaturization benefits.
Solution Approach 2:
The plating layer serves multiple functions simultaneously: it provides corrosion resistance against plating solutions, acts as a moisture barrier, and maintains electrical conductivity for external connections. This multi-functionality reduces the need for additional specialized components, thereby reducing overall structural complexity despite the miniaturized design.
Data Source
AI summary
A multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately disposed with respective dielectric layers interposed therebetween; a first external electrode including a first connection portion, and first and second band portions extending from the first connection portion; a second external electrode including a second connection portion, and second and fourth band portions extending from the second connection portion; an insulating layer disposed to extend to a portion on the first and second connection portions; a first plating layer disposed on the first band portion and disposed to extend to be in contact with the insulating layer; and a second plating layer disposed on the second band portion and disposed to extend to be in contact with the insulating layer. An average thickness of the first or second plating layer is smaller than an average thickness of the insulating layer.