Multilayer electronic component
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in achieving improved bending strength and moisture resistance reliability, particularly due to the penetration of external moisture through epoxy used to enhance bending strength.
Innovation Solution
The multilayer electronic component incorporates a body with a dielectric layer and internal electrodes alternately stacked, and an external electrode structure that includes a connection electrode layer with copper and glass, a band electrode layer with silver and glass, and a conductive resin layer with a conductive metal and resin, which is disposed between the band electrode layer and the plating layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If epoxy is added to external electrode to improve bending strength, then bending strength characteristics are improved, but moisture resistance reliability deteriorates due to easy penetration of external moisture
Solution Approach 1:
The patent uses a composite material structure for the external electrode consisting of multiple layers: a base electrode layer, an intermediate layer with conductive resin and metal particles, and a top plating layer. This composite structure provides both mechanical strength from the resin matrix and moisture barrier properties from the dense metal particle network and plating layer, resolving the contradiction between bending strength and moisture resistance.
Solution Approach 2:
The patent applies different materials and structures to different regions of the external electrode. The intermediate layer contains conductive resin with metal particles distributed throughout, creating localized conductive pathways while the resin matrix provides mechanical strength. The top plating layer provides enhanced moisture barrier properties, ensuring that each region performs its specific function optimally.
2Volume of moving object
If miniaturization is pursued to meet high-output demands, then device size is reduced, but bending strength and reliability under harsh environments deteriorate
Solution Approach 1:
The patent employs composite materials in the external electrode structure, particularly the intermediate layer combining conductive resin with metal particles. This composite provides high strength-to-volume ratio, enabling miniaturization while maintaining bending strength. The multi-layer composite structure optimizes space utilization and mechanical properties in a compact form factor.
Solution Approach 2:
The patent optimizes parameters such as the size and distribution of metal particles within the conductive resin, the thickness ratios of different electrode layers, and the composition of the plating layer. These parameter optimizations enable the external electrode to achieve maximum strength and conductivity in minimal space, supporting device miniaturization.
3Volume of moving object
If miniaturization is pursued to meet high-output demands, then device size is reduced, but moisture resistance reliability deteriorates
Solution Approach 1:
The patent uses composite materials where the intermediate layer combines conductive resin with metal particles, creating a dense structure that acts as an effective moisture barrier. The top plating layer further enhances this barrier function. This composite approach provides superior moisture resistance in a miniaturized form factor.
Solution Approach 2:
The patent applies enhanced moisture barrier properties locally at the external electrode surface through the plating layer and the metal particle-rich intermediate layer. This localized enhancement of barrier properties ensures moisture resistance reliability is maintained even as the overall device size is reduced.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the bending strength characteristics and improves moisture resistance reliability by effectively absorbing bending stress and suppressing moisture penetration, thereby ensuring the reliability of the multilayer electronic component in harsh environments.
Implementation Method 1
the conductive resin layer includes a conductive metal and a resin... effectively absorbing bending stress
Implementation Method 2
in the epoxy, since it is easy for external moisture to penetrate... suppressing moisture penetration
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, and a plating layer disposed on the electrode layer, wherein the electrode layer includes a connection electrode layer including copper (Cu) and glass, and a band electrode layer including silver (Ag) and glass, and the external electrode further includes a conductive resin layer disposed between the band electrode layer and the plating layer and including a conductive metal and a resin.