Multilayer Electronic Component External Electrode Plating
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Solution Overview
Problem
The existing methods for forming external electrodes on multilayer electronic components, such as ceramic capacitors, face challenges in ensuring reliable electrical connections and preventing defects like joining defects and insulation resistance degradation, especially when the distance between internal electrodes is large, and require additional dummy electrodes increasing manufacturing complexity and cost.
Innovation Solution
A method involving the preparation of a laminate with exposed internal electrodes, attachment of conductive particles via sandblasting or brushing, followed by plating to form thick-film edge electrodes and external electrodes, which facilitates linking of plating deposits and eliminates the need for dummy electrodes, ensuring reliable electrical connections and improved manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of stationary object
If plating is performed directly on the end surfaces of the laminate without electrode paste film, then the effective volume for capacitance can be increased, but joining defects may occur and insulation resistance may be degraded due to poor linking of plating deposits
Solution Approach 1:
Conductive particles are attached to the end surfaces of the laminate before plating is performed. This preliminary action creates nucleation sites that facilitate the linking of plating deposits, ensuring reliable joining and maintaining insulation resistance while allowing direct plating without electrode paste film
Solution Approach 2:
Conductive particles serve as an intermediary between the laminate end surfaces and the plating deposits. These particles enable effective linking of plating deposits even when the distance between internal electrode ends is large, preventing joining defects and insulation resistance degradation
2Quantity of substance
If the thickness of electrode paste film is increased to ensure adequate capacitance volume, then the capacitance can be maintained, but the overall size of the multilayer electronic component increases
Solution Approach 1:
The electrode paste film is extracted and removed from the structure. Instead, conductive particles are attached directly to the end surfaces, followed by plating, creating external electrodes with adequate capacitance volume while minimizing overall component size
3Reliability
If dummy electrodes are added to facilitate plating deposit linking, then external electrodes can be formed on side surfaces, but the manufacturing complexity and cost increase
Solution Approach 1:
Dummy electrodes are extracted and removed from the manufacturing process. The attachment of conductive particles to end surfaces followed by direct plating achieves effective plating deposit linking without requiring additional dummy electrode structures
Solution Approach 2:
Conductive particles are selectively attached only to the end surfaces of the laminate where internal electrode ends are exposed. This localized approach facilitates plating deposit linking exactly where needed without requiring global structural modifications like dummy electrodes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability of external electrode formation by facilitating plating linkages, reducing defects, and lowering manufacturing costs by eliminating the need for dummy electrodes, while ensuring effective electrical connections and preventing moisture penetration during soldering.
Implementation Method 1
attachment of conductive particles via sandblasting or brushing
Implementation Method 2
followed by plating to form thick-film edge electrodes and external electrodes
Data Source
AI summary
A method for manufacturing a multilayer electronic component includes a step of preparing a laminate which includes a plurality of stacked insulator layers and a plurality of internal electrodes extending along the interfaces between the insulator layers, and in which an end of each of the plurality of internal electrodes is exposed at a predetermined surface corresponding to one of the first and second end surfaces; a step of forming external electrodes on the predetermined surfaces; and a step of forming thick-film edge electrodes at edge portions. The step of forming external electrodes includes a step of attaching a plurality of conductive particles having a particle size of about 1 μm or more to the predetermined surfaces of the laminate, and a step of performing plating directly on the predetermined surfaces to which the conductive particles are attached.