Multilayer Electronic Component Electrode Structure for Plating Adhesion
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Solution Overview
Problem
The interlayer adhesive force between external electrodes in multilayer electronic components with a Cu and glass base electrode layer is compromised due to incomplete plating on glass surfaces and insufficient adhesive force between the electrode and conductive resin layers, affecting moisture resistance, ESR characteristics, and thermal stability.
Innovation Solution
Incorporating an oxide layer containing Cu adjacent to the plating or conductive resin layers on the Cu and glass electrode surfaces to enhance adhesion and plating properties, ensuring a robust external electrode structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a plating layer is formed on the electrode layer including Cu and glass, then electrical conductivity and airtightness are improved, but the plating layer is not sufficiently formed on the glass surface
Solution Approach 1:
The patent introduces an intermediary layer between the glass surface and the plating layer to facilitate proper plating formation. This intermediary layer acts as a mediator that enables the plating process to adhere effectively to the glass surface, which otherwise has poor plating characteristics, thereby achieving sufficient plating coverage and airtightness.
Solution Approach 2:
The patent modifies the surface properties of the glass or the electrode layer by changing chemical composition or surface treatment parameters to enhance plating adhesion. By adjusting parameters such as surface energy, roughness, or chemical reactivity, the glass surface becomes more suitable for plating deposition, ensuring complete and uniform plating coverage.
2Strength
If a conductive resin layer is formed on the electrode layer, then mechanical strength and mountability are improved, but adhesive force between the layers is insufficient
Solution Approach 1:
The patent introduces an intermediary layer between the electrode layer and the conductive resin layer to enhance adhesion. This intermediary layer serves as a bonding bridge that improves the adhesive force between the electrode layer and the conductive resin layer, ensuring strong mechanical bonding while maintaining the structural integrity and mountability of the component.
3Reliability
If the electrode layer includes Cu and glass, then electrical conductivity is improved, but interlayer adhesive force is reduced
Solution Approach 1:
The patent employs composite material structures in the external electrode, combining multiple materials with complementary properties. The external electrode includes a conductive metal powder component for electrical conductivity, a glass component for adhesion and mechanical strength, and additional components that enhance interlayer bonding. This composite approach allows the electrode layer to simultaneously achieve high electrical conductivity and strong interlayer adhesive force.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves the interlayer adhesive force, plating properties, and overall reliability of multilayer electronic components by preventing incomplete plating and securing better adhesion, thereby enhancing moisture resistance, ESR characteristics, and thermal stability.
Implementation Method 1
an oxide including Cu is disposed on at least a portion of Cu and at least a portion of the glass disposed adjacent to the plating layer
Data Source
AI summary
A multilayer electronic component according to an example embodiment of the present disclosure includes: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein the external electrode includes an electrode layer disposed on the body and connected to an internal electrode and including Cu and glass, and a plating layer disposed on the electrode layer, at least a portion of the Cu and at least a portion of the glass are disposed adjacent to the plating layer, and an oxide including Cu is disposed on at least a portion of Cu and at least a portion of the glass disposed adjacent to the plating layer.