Multilayer Electronic Component Electrode Structure for Sealing
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Solution Overview
Problem
Existing multilayer ceramic capacitors face challenges in maintaining high capacitance per unit volume and effective sealing when exposed to harsh environments, with issues arising from the penetration of plating solutions during electrode formation and vulnerability to external substances.
Innovation Solution
The external electrode structure is designed with a center portion and side portions, where the content of Cu-containing oxide is higher in the side portions, which are formed thicker to reduce the overall electrode proportion and enhance sealing, using a conductive paste with fine copper powder and glass powder particles to control the shape and composition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thickness of the electrode layer is reduced to improve capacitance per unit volume, then the proportion of the external electrode decreases and capacitance increases, but the plating solution easily penetrates during the plating layer formation process compromising sealing
Solution Approach 1:
The electrode layer is designed with spatially varying thickness: a first electrode layer with thickness of 3-6 μm in the center region and a second electrode layer with thickness of 1-3 μm in the side regions. This local differentiation allows the center portion to provide electrical connectivity while the thicker side portions prevent plating solution penetration, resolving the contradiction between reducing electrode proportion for higher capacitance and maintaining sealing properties.
2Quantity of substance
If the electrode layer is made thinner to reduce external electrode proportion, then capacitance per unit volume improves, but the electrode layer becomes more vulnerable to external substances in harsh environments
Solution Approach 1:
The electrode layer thickness is locally optimized with thicker side regions (1-3 μm) that provide enhanced protection against external substance penetration while the center region (3-6 μm) maintains electrical functionality. This spatial variation in thickness allows the component to achieve high capacitance per unit volume while the thicker side portions act as barriers against harmful external factors in harsh environments.
3Quantity of substance
If the electrode layer thickness is uniformly reduced, then manufacturing simplicity is maintained and capacitance increases, but fine adjustment capability is lost leading to plating solution penetration
Solution Approach 1:
The electrode layer is segmented into two distinct regions with different thicknesses: a center region (3-6 μm) and side regions (1-3 μm). This segmentation allows each region to be optimized for its specific function while maintaining manufacturability. The segmented structure provides the fine adjustment capability needed to prevent plating solution penetration without sacrificing the overall simplicity of the manufacturing process.
Data Source
AI summary
A multilayer electronic component may include: a body including a dielectric layer and internal electrodes alternately arranged in a first direction with the dielectric layer interposed therebetween; and external electrodes respectively disposed on surfaces of the body opposing each other in a second direction perpendicular to the first direction, and the external electrodes may include electrode layers connected to the internal electrodes and including Cu and a Cu-containing oxide, and in the electrode layer, when a region disposed on a center of the body in the first direction is defined as a center portion, and regions disposed on both sides of the center portion in the first direction and having a convex shape in the second direction are defined as side portions, a content of the Cu-containing oxide in the side portion may be greater than the content of the Cu-containing oxide in the center portion.