Multilayer Electronic Component Electrode Structure for Short-Circuit Control
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges with smaller size and higher capacitance requirements, leading to issues like short circuits, reduced capacitance, and lower breakdown voltage due to thinner internal electrodes with non-uniform connectivity and smoothness.
Innovation Solution
The solution involves controlling the area fraction of the capacitance formation portion to ensure uniform connectivity and smoothness of internal electrodes, achieved by maintaining a specific brightness intensity ratio within the cover portions, and using a manufacturing method that includes coating a silicone pattern on a polymer sheet and transferring a paste for internal electrodes to ceramic green sheets for precise stacking and sintering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the internal electrode thickness is reduced to achieve smaller size and higher capacitance, then the component size decreases and capacitance increases, but short circuits between internal electrodes occur and reliability deteriorates
Solution Approach 1:
The patent applies parameter changes by optimizing the thickness of the internal electrode within a specific range (0.3 μm to 1.0 μm) and controlling the area fraction of the capacitance formation portion (5% to 20%) to achieve the desired balance between miniaturization and reliability. By precisely controlling these parameters, the invention enables thinner electrodes without causing short circuits.
Solution Approach 2:
The patent implements local quality by creating a non-uniform internal electrode structure where the electrode thickness varies across different regions. Specifically, the internal electrode has a first thickness in a first region and a second thickness different from the first thickness in a second region, allowing thicker sections to prevent short circuits while thinner sections enable miniaturization.
2Quantity of substance
If the internal electrode thickness is reduced to achieve higher capacitance, then the capacitance increases, but the breakdown voltage decreases and reliability deteriorates
Solution Approach 1:
The patent controls the internal electrode thickness within a specific range (0.3 μm to 1.0 μm) and adjusts the area fraction of the capacitance formation portion (5% to 20%) to optimize the balance between capacitance and breakdown voltage. This parameter optimization enables higher capacitance while maintaining adequate breakdown voltage through precise dimensional control.
Solution Approach 2:
The patent employs local quality by varying the internal electrode thickness across different regions of the component. The electrode has different thicknesses in different regions, allowing the structure to achieve high overall capacitance while maintaining local regions with sufficient thickness to withstand breakdown voltage requirements.
3Volume of moving object
If the internal electrode thickness is reduced to achieve smaller size, then the component size decreases, but the connectivity uniformity deteriorates and manufacturing precision becomes harder to control
Solution Approach 1:
The patent specifies precise parameter ranges to control manufacturing precision: internal electrode thickness (0.3 μm to 1.0 μm) and area fraction of capacitance formation portion (5% to 20%). These controlled parameters ensure that even with reduced overall size, the connectivity uniformity is maintained within acceptable tolerances during manufacturing.
Solution Approach 2:
The patent addresses manufacturing precision by implementing local quality variations in the internal electrode structure. By having different thicknesses in different regions, the design compensates for manufacturing variations and ensures uniform connectivity across the component, making the manufacturing process more controllable despite the reduced overall dimensions.
Data Source
AI summary
Controlling an area fraction of a region of a capacitance formation portion of a multilayer electronic component may suppress occurrence of a short circuit between internal electrodes disposed inside a body of the multilayer electronic component, lower capacitance or reduced breakdown voltage. A range of brightness intensity of the region of the capacitance formation portion of the multilayer electronic component is 110% or more and 126% or less compared to an average value of brightness intensity of a cover portion disposed on the capacitance formation portion.