Multilayer Embedded Inductors for Compact Power Regulation
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Solution Overview
Problem
Current power management systems face challenges in reducing size while maintaining effective power management, requiring new components and methods to minimize space consumption in electronic systems.
Innovation Solution
The integration of multilayer electrical routing structures with inductive devices, such as serpentine and solenoid coils, within electronic packages to efficiently route and regulate power signals, utilizing conductive vias for interlayer connections and shielding to minimize electromagnetic noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If power management systems are reduced in size to meet customer needs, then the compactness and portability of electronic systems are improved, but the space for electronic components is reduced and eliminated
Solution Approach 1:
The patent merges the inductor and capacitor components into a single integrated power management device. The inductor is formed by conductive traces on the substrate, and the capacitor is formed by conductive plates and dielectric layers within the same device structure, eliminating the need for separate discrete components and reducing overall system size.
Solution Approach 2:
The patent implements nesting by placing the capacitor structure within and around the inductor structure. The conductive plates of the capacitor are positioned between the turns of the inductor winding, and the dielectric layers are integrated into the same vertical space, effectively utilizing three-dimensional space to accommodate multiple components in a compact footprint.
2Area of stationary object
If discrete inductors and capacitors are integrated into a single device, then the space consumption is reduced, but the device complexity increases
Solution Approach 1:
The patent segments the integrated device into distinct functional regions: the inductor section with its conductive traces and turns, the capacitor section with its conductive plates and dielectric layers, and the connection terminals. This segmentation allows each component to be designed and fabricated using standard PCB and semiconductor manufacturing processes, reducing the complexity of integration while maintaining compact dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables compact power management solutions by reducing ripple in power output signals and minimizing electromagnetic noise, effectively addressing the need for smaller form factors in electronic systems.
Implementation Method 1
The one or more electrical conductors form an integrated inductive device having a respective portion disposed on each of the at least two layers
Data Source
AI summary
An electronic package comprises an integrated circuit (IC) configured to receive a power input signal and to deliver a regulated power output signal. A multilayer electrical routing structure is attached to the IC and is configured to couple the electronic package to an external circuit. The multilayer routing structure has one or more electrical conductors on each of at least two layers which are configured to route the power input signal from the external circuit to the IC and to route the regulated power output signal from the IC to the external circuit. The one or more electrical conductors form an integrated inductive device having a respective portion disposed on each of the at least two layers and the power output signal is coupled to the external circuit through the integrated inductive device.