Multilayer Encapsulation for Electronic Components

The patent employs a composite encapsulation structure consisting of multiple double layers, where each double layer comprises an inorganic layer (such as aluminum oxide or aluminum hydroxide) and an organic monomolecular layer (such as self-assembled monolayers). This composite structure combines the advantages of inorganic materials (impermeability to gases and moisture) with organic materials (ability to fill defects and provide chemical stability), creating a synergistic barrier that effectively prevents reactions between atmospheric oxygen/moisture and reactive electronic component materials, thereby extending service life.

The encapsulation is divided into multiple double layers rather than using a single thick layer. Each double layer consists of two distinct sub-layers with different functions. This segmentation allows each layer to be optimized for specific protective functions and enables the encapsulation to address different failure modes (pinholes, cracks, permeation) through the combined action of multiple layers, significantly improving overall reliability.

The patent utilizes extremely thin film layers to achieve effective encapsulation. The inorganic layers are deposited as thin films (typically nanometer scale), and the organic monomolecular layers provide additional protection at the molecular level. This thin-film approach provides sufficient shielding against oxygen and moisture penetration while minimizing material consumption and reducing the complexity of deposition processes, thereby lowering both material and manufacturing costs compared to conventional thicker encapsulation layers.

The patent changes the parameters of the encapsulation layers by using ultrathin inorganic layers combined with monomolecular organic layers, rather than conventional thicker organic or polymeric encapsulation. This parameter change (reducing thickness while maintaining or improving protective performance) achieves cost-effective manufacturing by reducing material usage and simplifying processing, while the alternating structure maintains effective barrier properties.

The organic monomolecular layers in the double layer structure exhibit self-organizing properties, automatically forming ordered arrangements that fill defects and pinholes in the inorganic layers. This self-service mechanism occurs without requiring complex external processing or alignment steps, as the molecules spontaneously organize themselves to provide optimal protective coverage, thereby enhancing shielding effectiveness while keeping the manufacturing process relatively simple.

The encapsulation structure is organized as nested double layers, where each double layer contains an inorganic layer and an organic layer arranged in a specific sequence. These double layers are stacked alternately to form a multilayer encapsulation system. This nested arrangement allows each layer to contribute its specific protective function while maintaining a systematic and manageable structure that can be deposited using sequential processing steps, balancing shielding effectiveness with manufacturing simplicity.