Electronic Panel Multilayer Encapsulation for Moisture and Oxygen Blocking

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Solution Overview

Problem

Organic light emitting display panels are susceptible to damage from moisture and oxygen, which affects their lifespan and reliability.

Innovation Solution

The electronic panel design includes a base substrate with recess patterns, an encapsulation layer comprising inorganic and organic layers, and a protective pattern, along with a module hole and partition structures to enhance moisture and oxygen barrier properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If an organic light emitting element is used to achieve low power consumption and high brightness, then the display performance is improved, but the element becomes easily damaged by moisture or oxygen, reducing reliability

Engineering Contradiction:
ImprovebrightnessVSAvoidresistance to moisture and oxygen damage
Core Design Contradiction:
Illumination intensityVSReliability

Solution Approach 1:

The encapsulation layer is divided into multiple inorganic layers and organic layers with different functions. The first inorganic layer provides primary barrier protection, the organic layer provides secondary protection and planarization, and the second inorganic layer provides additional barrier protection. This segmented multi-layer structure effectively blocks moisture and oxygen while protecting the organic light emitting element.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The encapsulation layer uses a composite structure combining inorganic materials (first and second inorganic layers) and organic materials (organic layer). This composite approach leverages the advantages of both material types: inorganic materials provide excellent moisture and oxygen barrier properties, while organic materials provide flexibility and planarization, creating a comprehensive protection system.

Inventive Principle:
Principle #40Composite materials

2Device complexity

If a simple encapsulation structure is used to reduce manufacturing complexity, then the manufacturing process is simplified, but the protection against moisture and oxygen is insufficient

Engineering Contradiction:
Improveencapsulation structure complexityVSAvoidprotection against moisture and oxygen
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The encapsulation structure is segmented into distinct functional layers: a first inorganic layer for primary barrier protection, an organic layer for secondary protection and surface planarization, and a second inorganic layer for additional barrier protection. This segmentation allows each layer to be optimized for its specific function while maintaining a systematic manufacturing approach.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The encapsulation structure employs a nested multi-layer configuration where the organic layer is positioned between the first and second inorganic layers. This nested arrangement creates a comprehensive barrier system where each layer contributes to the overall protection, with the organic layer filling gaps and providing planarization between the inorganic barrier layers.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Reliability

If the encapsulation layer completely covers the hole area to maximize protection, then moisture and oxygen blocking is improved, but the module hole functionality is compromised

Engineering Contradiction:
Improvemoisture and oxygen blockingVSAvoidmodule hole functionality
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The encapsulation layer is selectively positioned to cover specific areas: the pixels in the display area and the recess patterns in the hole area. The layer does not completely cover the module hole, allowing the hole to maintain its functionality for light transmission or component access while still providing protection to the surrounding sensitive areas through localized coverage.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The encapsulation layer functions as a flexible thin film structure that can conform to the complex geometry of the display panel, including the recess patterns and module hole area. This thin film approach provides effective barrier protection while maintaining the structural integrity and functional requirements of the hole area.

Inventive Principle:
Principle #30Flexible shells and thin films

Data Source

PatentUS20250280657A1Electronic panel and method of manufacturing the same
Publication Date: 2025.09.04 SAMSUNG DISPLAY CO LTD
  • US20250280657A1 patent drawing
  • US20250280657A1 patent drawing
  • US20250280657A1 patent drawing

AI summary

An electronic panel comprises a base substrate which comprises a front surface comprising a hole area and a display area surrounding the hole area and a rear surface and comprises a module hole located in the hole area and a plurality of recess patterns located in the hole area, a plurality of pixels, an encapsulation layer covering the pixels and comprising a first inorganic layer, a second inorganic layer, and an organic layer, and a protective pattern located in the hole area and spaced apart from the organic layer when viewed in a plan view. The recess patterns comprise a filled recess pattern filled with at least one of the organic layer or the protective pattern, and an exposed recess pattern exposed from the organic layer and the protective pattern.