Multi-Layer Encapsulation for Partial Discharge Suppression
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Solution Overview
Problem
High-voltage solid-state devices face breakdown and partial discharge issues due to electrical discharges between electrodes, leading to insulation degradation and potential catastrophic failure, which existing encapsulation materials fail to adequately address.
Innovation Solution
A multi-layer encapsulation configuration using dielectric materials with molecular bonds at interfaces to prevent charge carrier crossing, combined with semi-conductive materials to inhibit charge accumulation and bridge layers, enhancing the device's ability to withstand higher electric fields.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing encapsulation materials are used, then the device structure is simple, but the device suffers from breakdown and partial discharge issues leading to insulation degradation
Solution Approach 1:
The encapsulation material is divided into multiple layers with different dielectric properties. Each layer serves a specific function in suppressing partial discharges and preventing breakdown, transforming a single homogeneous material into a multi-functional layered structure that enhances reliability without excessive complexity
Solution Approach 2:
The patent uses composite encapsulation structures combining different dielectric materials (such as epoxy resin, polyimide, and silicone rubber) with complementary properties. This composite approach leverages the strengths of each material to achieve superior insulation reliability and partial discharge suppression compared to single-material encapsulation
2Power
If higher electric fields are withstood, then the device performance is improved, but partial discharge and breakdown risk increases
Solution Approach 1:
The patent modifies the dielectric parameters of the encapsulation material by selecting materials with specific dielectric constants, breakdown strengths, and partial discharge resistance. This parameter optimization allows the device to withstand higher electric fields while maintaining resistance to partial discharge and breakdown through careful material selection and layer configuration
3Reliability
If charge carriers cross between layers, then electrical conduction is enhanced, but insulation performance deteriorates
Solution Approach 1:
The patent creates interfaces between layers with specific molecular bonding characteristics that locally prevent charge carrier crossing. Each interface is designed with particular properties (such as chemical composition and bonding strength) to act as a barrier to charge carriers, while the bulk materials maintain their insulating properties, thus preventing insulation deterioration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses partial discharges and breakdowns, increasing the breakdown electric field and preventing catastrophic failures by inhibiting charge carrier crossing and distributing injected charges, thereby ensuring reliable operation of high-voltage solid-state devices.
Implementation Method 1
An interface between two adjacent layers of the multiple layers is configured to include molecular bonds to prevent charge carriers from crossing between the two adjacent layers
Implementation Method 2
The multi-layer encapsulation film comprises multiple layers of one or more dielectric materials
Data Source
AI summary
Devices, methods and techniques are disclosed to suppress electrical discharge and breakdown in insulating or encapsulation material(s) applied to solid-state devices. In one example aspect, a multi-layer encapsulation film includes a first layer of a first dielectric material and a second layer of a second dielectric material. An interface between the first layer and the second layer is configured to include molecular bonds to prevent charge carriers from crossing between the first layer and the second layer. The multi-layer encapsulation configuration is structured to allow an electrical contact and a substrate of the solid-state device to be at least partially surrounded by the multi-layer encapsulation configuration.