Display Panel Fan-Out Routing for Narrow-Bezel Impedance Control
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Solution Overview
Problem
The size of the bezel in display panels is increased due to the larger space occupied by the fan-out wire of the first metallic layer in display devices.
Innovation Solution
The fan-out wire is designed with portions on both the first and second metallic layers, where the impedance of the first metallic layer is greater than the second, and the width and distance between the first fan-out wire in specific areas are reduced to minimize space occupation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the width of the fan-out wire in the first metallic layer is widened to make the impedance similar to the second metallic layer, then the impedance uniformity is improved, but the space occupied by the fan-out wire increases and the bezel size becomes larger
Solution Approach 1:
The fan-out wire is configured to extend in both the first metallic layer and the second metallic layer, utilizing the vertical dimension (layer stacking) to reduce the horizontal space requirement. This multi-layer configuration allows the wire to achieve the required impedance characteristics without widening the bezel, as the impedance control is achieved through vertical layer utilization rather than horizontal width expansion.
Solution Approach 2:
The patent adjusts the width of the fan-out wire in the first metallic layer to be smaller than in the second metallic layer, compensating for the higher impedance of the first layer through optimized width parameters. By carefully controlling the width parameter w1 in the first metallic layer and w2 in the second metallic layer, the overall impedance uniformity is achieved while minimizing the space occupied by the fan-out wire structure.
2Reliability
If the fan-out wire occupies larger space to accommodate the first metallic layer requirements, then the impedance matching is achieved, but the bezel of the display panel is widened
Solution Approach 1:
The solution transitions from a single-layer horizontal wire configuration to a multi-layer vertical configuration. The fan-out wire spans across the first and second metallic layers, utilizing the vertical dimension to achieve impedance matching without increasing the horizontal bezel width. This dimensional transition allows compact integration while maintaining electrical performance.
Solution Approach 2:
The fan-out wire structure employs a composite configuration across different metallic layers, where the wire in the first metallic layer has different width characteristics than in the second metallic layer. This composite multi-layer structure enables optimized impedance matching by combining different geometric parameters in different layers, achieving the desired electrical performance without increasing the overall device footprint.
Data Source
AI summary
Embodiments of the present disclosure are directed to a display panel and a display device. The first fan-out wire in a first area is designed as a first portion of the first metallic layer and a second portion of a second metallic layer. The first portion of the first metallic layer is coupled to the second portion of the second metallic layer. The width of the first fan-out wire in the first area is less than the width of the fan-out wires in other areas. The distance between the first fan-out wires in the first area is less than the distance between the first fan-out wires in the other areas. While the impedance of the first fan-out wire is not increased or even reduced, the space occupied by the first fan-out wire is reduced.