Multi-layer Feed Board Integrating Antenna Components to Reduce PIM
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Antennas operating in multiple frequency bands face increased complexity and susceptibility to passive intermodulation (PIM) issues due to the large number of solder joint interfaces required to connect various feed boards, which are also prone to variability from hand soldering.
Innovation Solution
The implementation of a multi-layer feed board that integrates phase shifters, diplexers, and radiating elements, eliminating the need for solder interfaces between feed boards and using automated soldering processes like selective wave flow soldering to reduce PIM and improve reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple feed boards are used to accommodate increasing wireless demands and functional components, then the antenna can operate in multiple frequency bands with more features, but the number of solder joint interfaces increases, leading to increased susceptibility to passive intermodulation (PIM) issues
Solution Approach 1:
The patent combines multiple feed boards into a single integrated multi-layer feed board structure. Functional components for different frequency bands (LTE, WiMAX, WLAN) are mounted on different layers of the same feed board, eliminating the need for multiple separate feed boards and their associated solder joint interfaces. This integration reduces PIM issues while maintaining multi-frequency band operation capability.
Solution Approach 2:
The patent utilizes the vertical dimension by implementing a multi-layer feed board structure where different functional components are positioned on different layers. This allows multiple feed networks for different frequency bands to be stacked vertically, reducing horizontal space requirements and minimizing the number of external connections and solder joints needed.
2Device complexity
If multiple feed boards with numerous solder joint interfaces are used, then more functional components can be connected, but hand soldering processes increase variability and reduce assembly efficiency
Solution Approach 1:
By merging multiple feed boards into one multi-layer structure, the patent reduces the total number of soldering operations required. All functional components for multiple frequency bands can be soldered to the multi-layer feed board in a more consolidated process, improving assembly efficiency and reducing variability associated with numerous separate hand-soldered joints.
3Reliability
If traditional multi-feed board structures are used, then component connectivity is achieved, but the number of solder interfaces increases susceptibility to PIM issues
Solution Approach 1:
The patent extracts and eliminates the problematic solder joint interfaces between multiple feed boards by integrating all functional components onto a single multi-layer feed board. This removal of unnecessary interfaces directly reduces PIM susceptibility while maintaining all required connectivity through internal traces and connections within the multi-layer structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces PIM issues and enhances assembly efficiency by minimizing hand-soldered joints and improving the reliability of antenna components, while maintaining low temperature to prevent reflow of components during soldering.
Implementation Method 1
Solder joints are often used as interfaces to connect the coaxial cables to the functional components of the various feed boards
Implementation Method 2
using automated soldering processes like selective wave flow soldering to reduce PIM and improve reliability
Data Source
AI summary
Aspects of the present disclosure may be directed to a multi-layer feed-board with all the functional components, including phase shifters, diplexers, and dipole element, employed thereon. Therefore, solder interfaces at cable to functional component interfaces are no longer necessary. Instead, component interfaces are within the confines of the multi-layer feed-board, thereby reducing PIM issues attributed to solder joint interfaces.