Multilayer Feedthrough Capacitor Asymmetric Electrode Design
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Solution Overview
Problem
Existing multilayer feedthrough capacitors are not designed for built-in mounting in substrates, leading to issues with electrical connection and resin filling, resulting in potential air gaps and inadequate integration.
Innovation Solution
A multilayer feedthrough capacitor with a rectangular parallelepiped element body, where the terminal ground electrode is thinner than the terminal signal electrodes, allowing for reduced height and efficient resin flow, enabling secure built-in mounting and electrical connection to substrate wiring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the terminal ground electrode has the same thickness as the terminal signal electrodes, then the electrode structure is simplified and manufacturing is easier, but air gaps form around the terminal ground electrode during resin filling and built-in mounting reliability deteriorates
Solution Approach 1:
The patent applies asymmetry by making the terminal ground electrode thinner than the terminal signal electrodes. This asymmetric design creates a step difference that prevents air gaps during resin filling while maintaining manufacturing feasibility through controlled electrode thickness variation.
Solution Approach 2:
The patent applies local quality by varying the thickness of the terminal ground electrode specifically at the electrode portion that contacts the resin, while keeping other portions consistent. This localized thickness reduction addresses the resin filling issue without affecting the overall electrode functionality.
2Length of stationary object
If the element body length in the first direction is reduced, then the capacitor height is reduced for better substrate integration, but the internal electrode arrangement becomes more constrained
Solution Approach 1:
The patent applies dimensionality change by optimizing the element body dimensions across multiple directions. By reducing the length in the first direction while maintaining appropriate lengths in the second and third directions, the patent achieves reduced height for substrate integration while preserving internal electrode arrangement feasibility through dimensional optimization.
3Shape
If the capacitor is designed for built-in mounting with reduced height, then substrate integration is improved, but traditional electrode configurations become inadequate for resin filling and electrical connection
Solution Approach 1:
The patent applies parameter changes by modifying the thickness parameter of the terminal ground electrode. This parameter change enables the capacitor to achieve reduced height for built-in mounting while maintaining adequate electrical connection capability through optimized electrode dimensions.
Data Source
AI summary
An element body includes principal surfaces opposing each other in a first direction, first side surfaces opposing each other in a second direction perpendicular to the first direction, and second side surfaces opposing each other in a third direction perpendicular to the first and second directions. A length in the first direction of the element body is smaller than a length in the second direction of the element body and a length in the third direction of the element body. Each of the first and second terminal signal electrodes and the terminal ground electrode includes an electrode portion disposed on the principal surface. A thickness of the electrode portion of the terminal ground electrode is smaller than a thickness of the electrode portion of the first terminal signal electrode and smaller than a thickness of the electrode portion of the second terminal signal electrode.