Multilayer Feedthrough Capacitor Parallel Electrode Design
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Solution Overview
Problem
Conventional multilayer feedthrough capacitors require multiple components to achieve parallel capacitance, leading to increased mounting space and complexity in electronic devices.
Innovation Solution
A multilayer feedthrough capacitor design featuring a capacitor body with distinct grounding and signal inner electrodes, terminal electrodes, and connection electrode portions that allow for the connection of multiple capacitance components in parallel, optimizing space and impedance across a wide frequency range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple separate capacitor components are mounted to achieve parallel capacitance, then the required capacitance value can be obtained, but the mounting space and device complexity increase
Solution Approach 1:
The patent combines multiple capacitor elements into a single integrated multilayer feedthrough capacitor structure. Multiple dielectric layers with alternating signal and grounding electrodes are stacked and connected in parallel within one component, achieving the required total capacitance value while occupying only one mounting position instead of multiple separate components
Solution Approach 2:
The single capacitor body performs multiple functions by integrating several capacitance elements in parallel. The structure provides both the required capacitance value and parallel circuit functionality within one component, eliminating the need for multiple separate capacitor mounts and reducing overall device complexity
2Quantity of substance
If multiple separate capacitor components are used to achieve parallel capacitance, then the required capacitance value can be obtained, but the number of components and device complexity increase
Solution Approach 1:
The patent merges multiple capacitor elements into a single integrated structure with multiple dielectric layers and electrode pairs. The internal parallel connection of multiple capacitance elements within one component achieves the required total capacitance while reducing the component count from multiple separate capacitors to just one
Solution Approach 2:
The capacitor body is segmented into multiple functional layers with alternating signal and grounding electrodes. Each dielectric layer with its associated electrodes forms a discrete capacitance element, and these segmented elements are connected in parallel within the unified structure to achieve the target capacitance value
3Reliability
If connection electrode portions are positioned to oppose inner electrodes, then electrical connection is achieved, but unwanted capacitance coupling occurs between grounding and signal electrodes
Solution Approach 1:
The connection electrode portions are extracted from the opposing position relative to inner electrodes. Instead of being positioned to face the signal or grounding inner electrodes, the connection electrodes are arranged to connect capacitance elements in parallel without creating unwanted capacitive coupling, thus removing the harmful effect while maintaining electrical connectivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables a single element to realize multiple parallel capacitance components, reducing space requirements and maintaining low impedance across a wide frequency range by separating connection electrode portions and arranging terminal electrodes effectively.
Implementation Method 1
a capacitor body in which dielectric layers are alternately laminated with signal inner electrodes and grounding inner electrodes
Implementation Method 2
capacitor body having a dielectric characteristic
Data Source
AI summary
A capacitor body of a multilayer feedthrough capacitor is arranged with grounding inner electrodes and signal inner electrodes. The grounding inner electrodes include first and second grounding main electrode portions, grounding connection electrode portions having no areas opposing the signal inner electrodes, and first and second grounding lead electrode portions. The signal inner electrodes include first and second signal main electrode portions, signal connection electrode portions having no areas opposing the grounding inner electrodes, and first and second signal lead electrode portions.