Multilayer Feedthrough Capacitor Terminal Electrode Arrangement

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Solution Overview

Problem

Multilayer feedthrough capacitors in existing designs do not adequately address the reduction of equivalent series inductance (ESL) and wiring density issues when mounted on circuit boards, leading to reduced high-frequency operation and decreased wiring density.

Innovation Solution

The design features a multilayer feedthrough capacitor with signal and ground terminal electrodes arranged in proximity to each other, along with through-hole conductors, to minimize ESL and maximize wiring space by eliminating conductors between electrode regions, allowing for larger terminal electrodes and enhanced mounting strength.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If terminal electrodes are arranged in conventional configurations, then the capacitor structure is simple, but the equivalent series inductance (ESL) is high

Engineering Contradiction:
Improvecapacitor structureVSAvoidequivalent series inductance
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent merges the signal terminal electrode and ground terminal electrode into a closely integrated configuration, positioning them adjacent to each other on the same surface. This merging of previously separate electrode functions reduces the loop area and achieves sufficient ESL reduction while maintaining structural simplicity

Inventive Principle:
Principle #5Merging (Combining)

2Strength

If capacitor occupies more mounting surface area, then terminal electrodes can be larger for better mounting strength, but wiring density on circuit board decreases

Engineering Contradiction:
Improvemounting strengthVSAvoidwiring density
Core Design Contradiction:
StrengthVSProductivity

Solution Approach 1:

The patent transitions from conventional end-face electrode arrangements to a mounting surface arrangement, utilizing the lateral dimension of the capacitor body. By positioning terminal electrodes on the mounting surface in adjacent regions, the design achieves both larger electrode area for mounting strength and efficient space utilization for wiring density

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If conductors are arranged continuously across the mounting surface, then electrical connectivity is improved, but wiring space for circuit board mounting is reduced

Engineering Contradiction:
Improveelectrical connectivityVSAvoidwiring space
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent extracts the conductor arrangement from continuous coverage and selectively positions conductors only in specific regions where terminal electrodes are located. This extraction of conductors from the third region creates dedicated wiring space while maintaining electrical connectivity in the functional first and second regions

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS8395881B2Multilayer feedthrough capacitor and mounted structure of multilayer feedthrough capacitor
Publication Date: 2013.03.12 TDK CORP
  • US8395881B2 patent drawing
  • US8395881B2 patent drawing
  • US8395881B2 patent drawing

AI summary

A multilayer feedthrough capacitor has a capacitor element body of a substantially rectangular parallelepiped shape, a signal internal electrode, a ground internal electrode, first and second signal terminal electrodes, and a first ground terminal electrode. The capacitor element body includes first and second end faces opposed in a longitudinal direction thereof, and a mounting surface perpendicular to a direction in which a plurality of insulator layers are laminated. The first signal terminal electrode and the first ground terminal electrode are arranged in proximity to each other in a first region near the first end face in the mounting surface. The second signal terminal electrode is arranged in a second region near the second end face in the mounting surface. No conductor is arranged in a third region between the first region and the second region in the longitudinal direction of the capacitor element body, in the mounting surface.