Multilayer Felt Manufacturing Using Vacuum Adsorption and Segmentation

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Solution Overview

Problem

Existing single-layer felt manufacturing processes generate excessive fine dust, affecting worker health and increasing costs due to the need for additional dust protection measures, while also not effectively improving NVH performance in vehicles.

Innovation Solution

A multilayer felt manufacturing apparatus and method using a low-cost inner layer and a dust-preventing PET outer layer, where the inner layer is formed with a low-cost chip felt and the outer layer is made of PET material to minimize dust generation and enhance NVH performance by applying vacuum pressure and press molding techniques.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If single-layer felt is manufactured using chip felt material, then manufacturing cost is reduced, but excessive fine dust is generated affecting worker health and working environment

Engineering Contradiction:
Improvemanufacturing costVSAvoidfine dust generation
Core Design Contradiction:
Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The felt product is divided into multiple layers with different functions: an inner layer made of chip felt for cost-effectiveness and NVH performance, and an outer layer made of PET material for dust prevention. This segmentation allows each layer to perform its specific function optimally without compromising the others.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention uses a composite structure combining chip felt and PET materials in a multilayer configuration. The chip felt provides cost benefits and sound absorption properties, while the PET material provides dust resistance, creating a composite material system that achieves multiple objectives simultaneously.

Inventive Principle:
Principle #40Composite materials

2Device complexity

If single-layer felt is manufactured, then manufacturing process is simple, but NVH performance improvement is insufficient

Engineering Contradiction:
Improvemanufacturing process complexityVSAvoidNVH performance
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The felt structure is segmented into multiple layers, each contributing to NVH performance in different ways. The inner chip felt layer provides sound absorption, while the outer PET layer provides dust protection, achieving superior overall NVH performance compared to single-layer structures.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The composite multilayer structure combines materials with different properties to achieve enhanced NVH performance. The combination of chip felt and PET creates a material system that simultaneously provides sound insulation and dust protection, improving overall product reliability.

Inventive Principle:
Principle #40Composite materials

3Object-generated harmful factors

If protective film is attached to single-layer felt surface, then dust generation is prevented, but manufacturing cost increases

Engineering Contradiction:
Improvedust preventionVSAvoidmanufacturing cost
Core Design Contradiction:
Object-generated harmful factorsVSEase of manufacture

Solution Approach 1:

Instead of adding a separate protective film as an additional component, the dust protection function is merged into the felt structure itself by making the outer layer of PET material. This integration eliminates the need for separate protective films while maintaining dust prevention capabilities.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The PET material in the outer layer serves as an intrinsic protective barrier against dust, eliminating the need for additional protective films. This composite structure incorporates protection within the material itself rather than adding separate protective components.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The multilayer felt product reduces manufacturing costs and minimizes dust generation while maintaining or improving NVH performance by using a low-cost inner layer and a dust-preventing PET outer layer, effectively addressing the issues of dust and cost associated with single-layer felt production.

Implementation Method 1

vacuum pressure is applied to the vacuum suction gates 12 of the upper mold 10 as the vacuum source is operated, and in this case, the chip felt 33, which is supplied between the upper mold 10 and the lower mold 20, is adsorbed and fixed on a bottom surface of the upper mold 10 by vacuum pressure

Methodology Applied
Scientific EffectVacuum pressure: Vacuum

Implementation Method 2

a blower fan 36, which serves to allow the chip felt to flow toward the mold, is disposed at a rear end portion of the chip felt supply line 34. Therefore, the chip felt discharged from the chip felt supply gate 35 is supplied between the upper mold 10 and the lower mold 20 in the hermetic molding box 30 along the chip felt supply line 34 by blowing force that is generated by operating the blower fan 36

Methodology Applied
Scientific EffectBlowing force: Fan

Implementation Method 3

the upper mold 10 is moved downward toward the lower mold 20, and simultaneously, a pressing process of thermally compressing the chip felt 33 is performed, such that a single-layer molded felt product 38 is completely manufactured

Methodology Applied
Scientific EffectThermal compression: Compression

Data Source

PatentUS10119226B2Apparatus and method for manufacturing multilayer felt
Publication Date: 2018.11.06 HYUNDAI MOTOR CO LTD
  • US10119226B2 patent drawing
  • US10119226B2 patent drawing
  • US10119226B2 patent drawing

AI summary

An apparatus and a method for manufacturing multilayer felt to improve NVH (noise, vibration, and harshness) of a vehicle may include supplying first chip felt between an upper mold and a lower mold, and simultaneously, firstly adsorbing the first chip felt on a bottom surface of the upper mold by vacuum pressure applied to vacuum suction gates of the upper mold, supplying second chip felt between the upper mold and the lower mold, and simultaneously, secondly adsorbing the second chip felt on a surface of the first chip felt by vacuum pressure applied to the vacuum suction gates of the upper mold, to stack the second chip felt on the first chip felt, pressing the first chip felt and the second chip felt, which are stacked on each other, using a press molding operation of the upper mold and the lower mold, and forming a multilayer felt product.