Multilayer Filament Ablation Using Visible Wavelengths
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Solution Overview
Problem
Existing methods for preparing thin multilayer wires for electrochemical sensors face challenges in completely removing the outer metal layer without damaging the polymer layer, leading to non-uniform enzyme coating and affecting signal-to-noise ratio and linearity, which limits sensor miniaturization.
Innovation Solution
A process involving a filament with a core, a polymer layer, and an outer metal layer, where the filament is processed using electromagnetic radiation with a peak wavelength between 430 to 780 nm to selectively remove the outer metal layer while minimizing damage to the polymer layer, allowing for precise control of layer thickness and surface roughness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If high-precision laser ablation is used to remove the outer metal layer, then complete removal of the metal layer is achieved, but damages to the polymer layer occur
Solution Approach 1:
The patent changes the wavelength parameter of the electromagnetic radiation from conventional laser ranges to specifically 430-780 nm, which selectively affects the outer metal layer while being transparent to the polymer layer. This parameter change enables complete metal layer removal without polymer damage by tuning the radiation properties to match the absorption characteristics of the metal layer only.
Solution Approach 2:
The patent segments the electromagnetic radiation into a specific wavelength range (430-780 nm) that targets only the outer metal layer. This segmentation of the spectrum allows selective interaction with the metal layer while leaving the polymer layer unaffected, resolving the contradiction between complete metal removal and polymer preservation.
2Manufacturing precision
If the outer metal layer is completely ablated, then sensor preparation is enabled, but the polymer layer thickness is reduced below minimum requirements
Solution Approach 1:
By changing the wavelength parameter to 430-780 nm, the patent achieves selective ablation of the outer metal layer without affecting the polymer layer thickness. This allows complete metal removal while preserving the polymer layer at its original thickness, eliminating the need to maintain excessive thickness as a safety margin.
3Manufacturing precision
If laser ablation is applied to remove the outer metal layer, then the metal layer is completely removed, but the surface tension of the polymer layer becomes non-uniform
Solution Approach 1:
The patent changes the radiation wavelength to 430-780 nm, which interacts only with the outer metal layer and not with the polymer layer. This prevents any modification to the polymer surface structure, thereby maintaining uniform surface tension across the entire polymer surface while still achieving complete metal layer removal.
4Length of moving object
If the wire diameter is reduced for miniaturization, then sensor size is reduced, but complete removal of the outer metal layer becomes difficult without polymer damage
Solution Approach 1:
By changing to electromagnetic radiation in the 430-780 nm range, the patent achieves selective interaction with the outer metal layer regardless of wire diameter. This allows complete metal layer removal even in miniaturized sensors with thin walls, as the radiation selectively targets the metal without being constrained by the overall wire dimensions or risking polymer damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of thinner, more accurate electrochemical sensors with improved signal-to-noise ratio and linearity, facilitating further miniaturization of electrical devices without damaging the polymer layer.
Implementation Method 1
processing the segment of the filament by interaction of the segment with at least one beam of electromagnetic radiation of a first kind; wherein the electromagnetic radiation of the first kind has a spectrum with a peak wavelength in the range from 430 to 780 nm
Data Source
AI summary
One aspect relates to a process for preparing a processed filament, including provision of a filament, including a segment. At least in the segment, the filament includes a core, including a first metal, a first layer which is superimposed on the core, and includes a polymer, and a second layer which is superimposed on the first layer, and includes a second metal. The segment of the filament is processed by interaction of the segment with at least one beam of electromagnetic radiation of a first kind. The electromagnetic radiation of the first kind has a spectrum with a peak wavelength in the range from 430 to 780 nm. Further, one aspect relates to a processed filament, obtainable by the process; a filament; an electrical device, including at least a part of the processed filament.