Multi-layered Film Sputtering Adhesion Prevention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for manufacturing multi-layered films using ferroelectric materials like PZT face issues with sputtered particles adhering to the substrate's periphery, leading to complex processes and increased costs, especially when chemical elements with high vapor pressure are involved, affecting film characteristics and stability.
Innovation Solution
A multi-layered film configuration where the dielectric layer's lower surface contacts the first electroconductive layer, and its upper and side surfaces are coated with a second electroconductive layer, with the side end of the first electroconductive layer overlapping the second electroconductive layer inside the substrate's side end, preventing sputtered particle adhesion. This configuration is achieved through a specific manufacturing method and apparatus design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If sputtering method is used to form layered structure on substrate, then film formation efficiency is improved, but sputtered particles adhere to substrate periphery causing process complexity and cost increase
Solution Approach 1:
An adhesion-preventing plate is introduced as an intermediary component between the substrate and the sputtering environment. This plate acts as a physical barrier that intercepts sputtered particles before they can adhere to the substrate periphery, thereby eliminating the need for complex post-processing removal steps while maintaining efficient film formation
2Manufacturing precision
If adhesion-preventing plate is added to prevent sputtered particle adhesion, then manufacturing cost increases, but film uniformity is improved
Solution Approach 1:
The harmful effect of sputtered particle adhesion is extracted and isolated to the adhesion-preventing plate itself. By concentrating the protective function in this separate component, the main substrate and film structure remain uncontaminated, achieving high film uniformity without requiring expensive complex processing systems
3Reliability
If chemical elements with high vapor pressure are used in dielectric layer, then film characteristics are enhanced, but element scattering affects other layers and device stability
Solution Approach 1:
The adhesion-preventing plate serves as a mediator that also functions to contain scattered chemical elements. By positioning this plate to cover the substrate periphery, it creates a physical boundary that prevents high-vapor-pressure elements from the dielectric layer from scattering onto adjacent areas and contaminating other layers or device components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents sputtered particle adhesion to the substrate's surfaces, ensuring uniform film composition and characteristics, reducing manufacturing complexity and costs, and enabling the production of films with desired properties like high piezoelectricity and voltage resistance.
Implementation Method 1
it was studied what kind of problems occur when a layered structure having the first electroconductive layer 3, the dielectric layer 4, and the second electroconductive layer 5 which are sequentially layered therein on a main surface of the substrate 2 so as to coat the entire region of the main surface by use of a sputtering method
Data Source
AI summary
A multi-layered film includes a first electroconductive layer, a dielectric layer, and a second electroconductive layer, which are sequentially layered and disposed on a main surface of a substrate. A lower surface of the dielectric layer comes into contact with an upper surface of the first electroconductive layer, an upper surface and an side surface of the dielectric layer is coated with the second electroconductive layer, and an side end of a portion at which the first electroconductive layer directly overlaps the second electroconductive layer is located inside a side end of the substrate on the main surface of the substrate.