Multilayer Filter Stack Layout for EMI Shielding and Isolation
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Solution Overview
Problem
Compact mobile communication devices experience electromagnetic interference and degradation of isolation between filters due to high-density packaging, which existing technologies fail to adequately address.
Innovation Solution
A multilayer electronic component design with two filters, featuring ground conductor layers positioned closer to the surface than the filters, connected through holes, and a third ground conductor layer for electrical connectivity, which suppresses electromagnetic interference and maintains filter isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ground conductor layers are positioned closer to the second surface than the first surface in the stack, then electromagnetic interference is suppressed and filter isolation is maintained, but device complexity increases due to additional ground conductor layers and through holes
Solution Approach 1:
The ground conductor layer is segmented into multiple separate layers (first ground conductor layer and second ground conductor layer) positioned at different locations in the stack. This segmentation allows each ground layer to serve specific filtering functions, with the first ground layer suppressing electromagnetic interference for the first filter and the second ground layer for the second filter, thereby maintaining filter isolation while managing complexity through functional separation
Solution Approach 2:
The solution transitions from a two-dimensional planar arrangement to a three-dimensional stacked configuration with ground conductor layers positioned at different heights (closer to the second surface). This vertical dimensionality allows multiple ground layers to coexist without planar interference, enabling effective electromagnetic interference suppression and filter isolation maintenance while containing the complexity increase within the vertical stacking architecture
2Object-affected harmful factors
If multiple ground conductor layers and through holes are added to suppress electromagnetic interference, then shielding effectiveness is improved, but manufacturing complexity and production difficulty increase
Solution Approach 1:
Multiple ground conductor layers and through holes are merged into a single integrated stack structure where all components are pre-positioned and connected during one manufacturing process. The first and second ground conductor layers are combined with respective through holes to form unified shielding assemblies, allowing simultaneous formation of multiple shielding paths and reducing the need for separate assembly steps, thereby improving electromagnetic interference suppression while managing manufacturing complexity
Data Source
AI summary
An electronic component includes: a stack that includes a bottom surface and a top surface; a first ground conductor layer and a second ground conductor layer that are each integrated with the stack and connected to the ground; a first filter that is arranged between the bottom surface and the first ground conductor layer in the stack; and a second filter that is arranged between the bottom surface and the second ground conductor layer in the stack.