Multilayer Fluidic Bonding for Leak-Sealed Genomic Flowcells
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Solution Overview
Problem
The demand for genomic analysis has increased due to advancements in sequencing technology, leading to a high demand for arrays and flowcells, which are typically disposable, resulting in increased production costs and a need for improved fabrication methods to prevent cost impediments and counteract advances in other genetic analysis components.
Innovation Solution
A multilayer fluidic device is fabricated by bonding an inorganic solid support with a rigid structure to an organic solid support using a radiation-absorbing material that forms a seal against liquid flow, where the bonding layer is created by applying compression and irradiating the interface with radiation, avoiding the use of electrically conductive materials like metals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If arrays and flowcells are made disposable to meet increased demand for genomic analysis, then productivity and speed of analysis are improved, but manufacturing cost and loss of substance increase
Solution Approach 1:
The patent describes methods for fabricating disposable arrays and flowcells that enable high-throughput genomic analysis while controlling production costs through efficient manufacturing processes. The bonding techniques create reliable seals that prevent sample loss, allowing disposable use without excessive material waste.
Solution Approach 2:
The invention focuses on creating cost-effective disposable arrays and flowcells through improved fabrication methods. By using radiation-absorbing materials and laser bonding, the manufacturing process becomes more efficient and scalable, reducing the per-unit cost of disposable devices while maintaining high productivity.
2Ease of manufacture
If traditional bonding methods are used to attach inorganic and organic supports, then ease of manufacture is maintained, but reliability of sealing against liquid flow deteriorates
Solution Approach 1:
The patent introduces a radiation-absorbing material as an intermediary layer between the inorganic solid support and organic solid support. This intermediate layer enables laser-induced bonding that creates reliable seals while maintaining ease of manufacture through a straightforward multi-layer assembly process followed by laser treatment.
Solution Approach 2:
The bonding process utilizes phase transitions of the radiation-absorbing material when irradiated with laser energy. The material undergoes thermal or chemical phase changes that facilitate strong bonding between layers, creating reliable seals while keeping the manufacturing process simple and scalable.
3Strength
If electrically conductive materials like metals are used in the bonding layer, then strength of bonding is improved, but adaptability to detection methods deteriorates
Solution Approach 1:
The patent employs non-conductive radiation-absorbing materials that are compatible with disposable array and flowcell designs. These materials provide sufficient bonding strength for single-use applications while maintaining adaptability to various detection methods including fluorescence, as they do not interfere with optical detection pathways.
Solution Approach 2:
The invention changes the material parameters of the bonding layer by using radiation-absorbing materials with specific optical properties instead of traditional conductive metals. This parameter change enables compatibility with optical detection methods while maintaining adequate bonding strength through laser-induced bonding mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables cost-effective production of arrays and flowcells with precise fluidic manipulations and accurate high-resolution detection, supporting the scalability and clinical utility of genomic analysis platforms.
Implementation Method 1
the bonding layer includes a material that absorbs radiation at a wavelength that is transmitted by the inorganic solid support or the organic solid support
Implementation Method 2
applying compression at the interface and irradiating the radiation-absorbing material with the radiation to form a bonding layer
Data Source
AI summary
A fluidic device including an inorganic solid support attached to an organic solid support by a bonding layer, wherein the inorganic solid support has a rigid structure and wherein the bonding layer includes a material that absorbs radiation at a wavelength that is transmitted by the inorganic solid support or the organic solid support; and a channel formed by the inorganic solid support and the organic solid support, wherein the bonding layer that attaches the inorganic solid support to the organic solid support provides a seal against liquid flow. Methods for making fluidic devices, such as this, are also provided.