Multilayer Frame Package With Integrated Magnetic Shield

Solution Overview

Problem

Integrated circuit packages, particularly those containing magnetoresistive random access memory (MRAM) devices, face interference from external magnetic fields, which can affect device performance, and existing shielding solutions may not adequately address this issue while maintaining package compactness and manufacturing simplicity.

Innovation Solution

A multilayer frame package with a magnetic shield layer integrated between layers, using soft magnetic materials like nickel-iron alloys, which are secured within a sub-frame to minimize thickness and maintain package dimensions, thereby shielding IC devices from external magnetic fields without interfering with electrical signal routing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a metallic shield is provided adjacent to the IC device to shield from external magnetic fields, then the shielding effectiveness is improved, but the package thickness and dimensions increase

Engineering Contradiction:

Improvemagnetic field interferenceVSAvoidpackage thickness

Core Design Contradiction:

Object-affected harmful factorsVSLength of stationary object

Solution Approach 1:

The magnetic shield is merged with the frame structure by integrating it into the recessed region of the frame, combining the shielding function with the mechanical support function of the frame, thereby avoiding additional thickness from a separate shield component

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The magnetic shield is nested within the recessed region of the frame structure, placing the shielding layer inside the existing package geometry rather than adding it as an external layer, thus maintaining compact dimensions

Inventive Principle:

Principle #7Nested doll (Nesting)

2Object-affected harmful factors

If a metallic shield is provided adjacent to the IC device to shield from external magnetic fields, then the shielding effectiveness is improved, but the device complexity increases

Engineering Contradiction:

Improvemagnetic field interferenceVSAvoidpackage structure complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The magnetic shield is merged with the frame structure by integrating it into the recessed region of the frame, combining the shielding function with the mechanical support function of the frame, thereby avoiding additional complexity from a separate shield component

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The frame structure serves multiple functions: providing mechanical support, defining package geometry, and housing the magnetic shield through its recessed region, thereby reducing overall device complexity through multi-functionality

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Object-affected harmful factors

If a metallic shield is provided adjacent to the IC device to shield from external magnetic fields, then the shielding effectiveness is improved, but the manufacturing process becomes more complex

Engineering Contradiction:

Improvemagnetic field interferenceVSAvoidmanufacturing process simplicity

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The magnetic shield is pre-positioned within the recessed region of the frame during frame fabrication, rather than being added as a separate post-assembly step, thereby simplifying the overall manufacturing process

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The magnetic shield is merged with the frame structure by integrating it into the recessed region of the frame, combining the shielding function with the mechanical support function of the frame, thereby avoiding additional complexity from a separate shield component

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces the impact of external magnetic fields on MRAM devices while maintaining the compactness and manufacturing consistency of standard IC packages, enhancing the reliability and performance of magnetoresistive memory devices.

Implementation Method 1

a magnetic shield layer 220 including a magnetic shield 222 and a sub-frame 224. The magnetic shield layer 220 may be disposed between the top layer 210 and the bottom layer 230 of the multilayer frame package 200

Methodology Applied

Scientific EffectMagnetic shielding: Magnetism

Data Source

PatentUS10643954B2Multilayer frame packages for integrated circuits having a magnetic shield integrated therein, and methods therefor

Publication Date: 2020.05.05 EVERSPIN TECHNOLOGIES INC

AI summary

An integrated circuit package may comprise a multilayer frame package including: a bottom layer; and a magnetic shield layer, including a sub-frame and a magnetic shield disposed within a periphery of the sub-frame; and an integrated circuit die provided on or above the magnetic shield layer of the multilayer frame package.