Multi-layer Glass Core Substrate for IC Packaging
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Solution Overview
Problem
Current integrated circuit substrates face challenges in providing a reliable and efficient mechanical and electrical interface between IC dies and next-level components due to material limitations, such as warpage and mismatched thermal expansion coefficients, which affect the reliability and I/O capability of the packages.
Innovation Solution
A substrate with a multi-layer glass core is developed, where discrete glass layers are bonded together with adhesive or diffusion bonding, and conductive materials are deposited through holes to form conductors, enabling efficient electrical routing and mechanical support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single-layer substrate is used, then the manufacturing process is simple, but thermal expansion mismatch and warpage occur
Solution Approach 1:
The patent applies composite materials by bonding multiple glass layers with different thermal expansion coefficients to create a multi-layer glass core substrate. This composite structure compensates for thermal expansion mismatch with silicon dies while reducing warpage, resolving the contradiction between manufacturing simplicity and reliability.
Solution Approach 2:
The substrate is segmented into multiple discrete glass layers that can be independently selected and bonded together. Each layer serves a specific function in managing thermal expansion and mechanical properties, allowing the substrate to be optimized for reliability while maintaining manufacturability through modular assembly.
2Reliability
If multi-layer glass core is used, then thermal expansion mismatch and warpage are reduced, but manufacturing complexity increases
Solution Approach 1:
The multi-layer glass core uses composite materials with each layer having specific thermal expansion properties. The bonding of these layers creates a structured composite that manages thermal and mechanical stresses, achieving reliability improvement while the structured approach keeps manufacturing complexity manageable.
3Ease of manufacture
If conventional substrate materials are used, then manufacturing is easier, but I/O density and reliability are limited
Solution Approach 1:
The patent replaces conventional single-material substrates with multi-layer glass core composites. This composite structure provides superior thermal matching and mechanical stability, enabling higher I/O density and reliability while maintaining manufacturing feasibility through established bonding processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multi-layer glass core substrate reduces thermal expansion mismatch and warpage, allowing for higher I/O density and reliability by providing a stable and efficient mechanical and electrical interface between IC dies and next-level components.
Implementation Method 1
discrete glass layers are bonded together with adhesive or diffusion bonding
Implementation Method 2
discrete glass layers are bonded together with adhesive or diffusion bonding
Implementation Method 3
conductive materials are deposited through holes to form conductors
Data Source
AI summary
Disclosed are embodiments of a substrate for an integrated circuit (IC) device. The substrate includes a core comprised of two or more discrete glass layers that have been bonded together. A separate bonding layer may be disposed between adjacent glass layers to couple these layers together. The substrate may also include build-up structures on opposing sides of the multi-layer glass core, or perhaps on one side of the core. Electrically conductive terminals may be formed on both sides of the substrate, and an IC die may be coupled with the terminals on one side of the substrate. The terminals on the opposing side may be coupled with a next-level component, such as a circuit board. One or more conductors extend through the multi-layer glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the core. Other embodiments are described and claimed.