Multilayer Electronic Component Glass Barrier for Moisture Ingress
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Solution Overview
Problem
Multilayer electronic components face issues with moisture penetration due to insufficient wettability between conductive metals and glass in primary electrodes, and the boundary between the electrode and the body acts as a primary path for moisture and plating solution ingress, compromising reliability.
Innovation Solution
A protective layer made of glass, including Na and Fe, is strategically disposed between the external electrode layers and the body, enhancing the wettability of the glass with respect to the conductive metals and blocking moisture and plating solution penetration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If glass and conductive metal are mixed to form a primary electrode, then low-temperature sintering is promoted and interfacial bonding strength is improved, but wettability between glass and conductive metal is insufficient creating moisture penetration paths
Solution Approach 1:
The patent introduces a protective layer comprising glass particles with specific properties (including Na and Fe, with controlled particle size distribution) as an intermediary between the conductive metal and the body. This protective layer acts as a mediator that improves wettability and prevents moisture penetration along the interface between the primary electrode and the body, thereby resolving the contradiction between achieving strong bonding and preventing moisture ingress.
Solution Approach 2:
The patent modifies the composition and particle size distribution of glass particles in the protective layer (including Na and Fe content, particle size ranges) to optimize both wettability and moisture resistance. By changing the physical and chemical parameters of the glass material, the patent achieves improved interfacial bonding while simultaneously blocking moisture penetration paths.
2Quantity of substance
If the primary electrode is formed at the corner of the body, then electrode coverage is achieved, but the boundary portion becomes a main path for penetration of plating solution and external moisture
Solution Approach 1:
The patent applies a protective layer with specific glass particle composition and size distribution locally at the corner regions where the primary electrode meets the body. This localized application addresses the specific vulnerability at the boundary portion without affecting the overall electrode structure, preventing moisture and plating solution penetration at this critical location while maintaining electrode coverage.
Solution Approach 2:
The protective layer serves as an intermediary barrier between the primary electrode boundary and the external environment (moisture and plating solution). By positioning this glass-based protective layer at the interface, the patent creates a protective barrier that prevents harmful substances from penetrating along the electrode-body boundary while maintaining electrical connectivity.
3Strength
If higher sintering temperatures are used, then densification and mechanical strength are improved, but moisture resistance reliability may be compromised without proper protective measures
Solution Approach 1:
The patent applies the protective layer comprising specific glass particles before or during the sintering process, creating a pre-formed barrier that prevents moisture penetration even at higher sintering temperatures. This preliminary protective measure ensures that the interface remains protected throughout the sintering process and subsequent service conditions, maintaining both mechanical strength and moisture resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves the moisture resistance reliability of multilayer electronic components by forming a protective barrier that prevents external moisture and plating solution ingress, even at higher sintering temperatures, while maintaining capacitance per unit volume.
Implementation Method 1
enhancing the wettability of the glass with respect to the conductive metals
Implementation Method 2
glass may serve to promote low-temperature sintering during a sintering process and may fill pores between conductive metal particles at the same time, and to improve interfacial bonding strength
Implementation Method 3
forming a protective barrier that prevents external moisture and plating solution ingress
Implementation Method 4
glass may serve to promote low-temperature sintering during a sintering process
Data Source
AI summary
A protective layer including glass may be disposed between an end of a first electrode layer in contact with one end of an internal electrode and a body thereby blocking a penetration path of external moisture, a plating solution, and hydrogen to improve the moisture resistance reliability of a multilayer electronic component.