Multi-Layer Haptic Actuator Layout for Slim Mobile Devices

The patent transitions from a traditional linear arrangement of haptic actuator components to a multi-layer stacked configuration. The inductor is divided into multiple layers (first inductor layer, second inductor layer) stacked vertically, with the magnetic element positioned between them. This vertical stacking in the third dimension allows the system to maintain effective haptic feedback while reducing the horizontal footprint and overall device thickness.

The patent implements a nested arrangement where the magnetic element is positioned within the vertical space between the first and second inductor layers. The magnetic element is surrounded by the inductor structure in a nested configuration, maximizing space utilization. This nesting allows the magnetic field to be concentrated in a smaller volume, maintaining haptic effectiveness while minimizing the required thickness.

The inductor is segmented into multiple discrete layers (first inductor layer and second inductor layer), each with its own conductive trace pattern. This segmentation allows each layer to be fabricated independently using standard PCB multi-layer techniques, making the complex multi-layer structure manufacturable with existing industrial processes rather than requiring custom complex fabrication methods.

The multi-layer inductor structure serves multiple functions simultaneously: it generates the magnetic field for haptic feedback, provides electromagnetic coupling between layers, and can be integrated with other circuit elements on the same substrate. The conductive traces in each layer can also serve as both inductor elements and interconnects for other circuit functions, reducing overall manufacturing complexity.