Multilayer Heater Insulation for Low-Dissipation Reaction Tubes
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Solution Overview
Problem
Semiconductor device manufacturing processes consume a large amount of power, particularly in substrate processing apparatuses, where energy saving efficiency is limited due to excessive heat dissipation from reaction tubes.
Innovation Solution
A heater structure with a multilayer assembly comprising heat insulators and variable spaces, where the thermal conductivity and emissivity of the spaces and insulators are optimized to reduce heat dissipation, using a vacuum state and high thermal conductivity gases to manage heat transfer efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a conventional single-layer heat insulating structure is used, then the structure is simple, but the heat dissipation is excessive and energy saving efficiency is poor
Solution Approach 1:
The heat insulating structure is divided into multiple layers with different materials and functions. The multilayer assembly includes a first heat insulating layer, a second heat insulating layer, and a third heat insulating layer, each with specific thermal properties. This segmentation allows optimization of heat insulation performance while managing heat dissipation effectively.
Solution Approach 2:
The patent employs composite material structure where different heat insulating materials are combined in a multilayer configuration. Each layer uses materials with specific thermal conductivity characteristics, creating a composite system that optimizes both heat retention and controlled dissipation, resolving the contradiction between energy loss and structural complexity.
2Loss of energy
If the heat insulating structure is made thicker to reduce heat dissipation, then energy saving efficiency improves, but the apparatus size increases
Solution Approach 1:
Instead of using a single thick layer, the insulation is segmented into multiple thinner layers with different thermal properties. This multilayer approach achieves equivalent or superior insulation performance with reduced overall thickness, preventing excessive heat dissipation while maintaining compact apparatus dimensions.
Solution Approach 2:
Different regions of the heat insulating structure use materials with different thermal conductivities optimized for their specific functions. The first, second, and third heat insulating layers have progressively different thermal properties, allowing localized optimization that reduces overall thickness while maintaining effective heat dissipation control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces heat dissipation from the furnace, improving energy saving efficiency and allowing for rapid temperature control, thereby enhancing the productivity and thermal insulation performance of the substrate processing apparatus.
Implementation Method 1
a multilayer assembly located outside the heat insulating structure and provided with a plurality of spaces therein, wherein the multilayer assembly comprises a plurality of heat insulators arranged along a direction extending outward from the heat insulating structure
Implementation Method 2
an amount of a heat dissipated from the multilayer assembly is variable in accordance with a thermal conductivity of each of the spaces and a thermal emissivity of each of the heat insulators
Data Source
AI summary
It is possible to improve an energy saving efficiency of an apparatus. There is provided a technique using a heater structure that includes: a heat insulating structure provided with a heat generator configured to heat an inside of a reaction tube; and a multilayer assembly located outside the heat insulating structure and provided with a plurality of spaces therein, wherein the multilayer assembly comprises a plurality of heat insulators arranged along a direction extending outward from the heat insulating structure, the plurality of spaces are provided between the plurality of heat insulators, respectively, and an amount of a heat dissipated from the multilayer assembly is variable in accordance with a thermal conductivity of each of the spaces and a thermal emissivity of each of the heat insulators.