Multilayer Heating Member for Crack-Free OLED Lamination
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Solution Overview
Problem
The existing methods for forming large-area pixels in organic electroluminescent devices, such as the FMM method, face challenges with mask weight, stretching, and temperature expansion, making it difficult to laminate donor films onto acceptor substrates without causing cracks during peeling.
Innovation Solution
A laminating apparatus with a heater and a multilayer heating member structure, comprising a first conducting layer, a second conducting layer with different thermal conductivity, and a third conducting layer, which transfers heat to the donor film to reduce the lamination temperature and prevent cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional single-layer heating member is used for lamination, then the heating process is simple, but the lamination temperature is too high causing cracks in the acceptor substrate during donor film peeling
Solution Approach 1:
The heating member is divided into multiple conducting layers (first, second, and third conducting layers) with different thermal conductivities. This segmentation allows each layer to contribute differently to heat distribution, enabling precise temperature control at the donor film interface while preventing excessive heat accumulation that would cause substrate cracking during peeling.
Solution Approach 2:
Different conducting layers are assigned different thermal conductivity values to create localized thermal characteristics. The first conducting layer (higher thermal conductivity) provides efficient heat transfer from the heater, while the second and third layers (lower thermal conductivity) modulate heat distribution to maintain optimal lamination temperature and prevent thermal damage to the acceptor substrate.
2Use of energy by moving object
If high thermal conductivity material is used throughout the heating member, then heat transfer efficiency is high, but temperature control precision is poor leading to substrate damage
Solution Approach 1:
The heating member employs a gradient thermal conductivity structure where the first conducting layer has higher thermal conductivity for efficient heat uptake from the heater, while the second and third conducting layers have progressively lower thermal conductivity to modulate heat flow. This local variation in thermal properties enables both high heat transfer efficiency and precise temperature control at the donor film interface.
Solution Approach 2:
The heating member is constructed as a composite structure with multiple conducting layers made of different materials or with different thermal conductivity properties. This composite approach combines the advantages of high heat transfer (from the first layer) with temperature modulation and protection (from the second and third layers), achieving both efficiency and precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively reduces the formation of cracks in the acceptor substrate during donor film peeling and improves the reliability of separating the donor film from the acceptor substrate, enabling efficient manufacturing of organic light-emitting displays.
Implementation Method 1
a heating member which transfers heat received from the heater to a donor film
Implementation Method 2
a second conducting layer which is formed on the first conducting layer and which has a thermal conductivity different from that of the first conducting layer
Data Source
AI summary
In a laminating apparatus and a method of manufacturing an organic light-emitting display, the laminating apparatus includes a heater which generates heat and the heating member which transfers heat received from the heater to a donor film. The heating member includes a first conducting layer which receives heat from the heater, a second conducting layer which is formed on the first conducting layer and which has a thermal conductivity different from that of the first conducting layer, and a third conducting layer which is formed on the second conducting layer and which has a thermal conductivity different from that of the second conducting layer.