Multilayer Housing with Void Layer for Thermal Management
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Solution Overview
Problem
Electronic devices face challenges in efficiently transferring heat from internal components to the exterior while maintaining a safe operational temperature for the user, as existing housings often rely on unitary heat conductive materials or successive layers lacking voids, which can result in elevated temperatures for the user.
Innovation Solution
The use of multilayer housings with a first and second continuous layer, each comprising materials like copper, plastic, graphene, or aluminum, and a void layer with 5-95% voids, where the void layer includes a patterned adhesive, effectively migrating heat from the interior to the exterior without exposing the user to elevated temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If unitary heat conductive materials or successive layers of heat conductive materials are used in housing, then heat transfer from interior to exterior is improved, but user exposure to elevated temperatures worsens
Solution Approach 1:
The housing is divided into multiple layers with distinct functions: an inner heat conductive layer for heat transfer, an intermediate void layer for thermal insulation, and an outer layer for structural integrity. This segmentation allows the heat conductive material to efficiently transfer heat away from internal components while the void layer prevents this heat from reaching the user, thus resolving the contradiction between heat transfer efficiency and user safety.
Solution Approach 2:
The void layer acts as an intermediary between the inner heat conductive layer and the outer layer. It mediates the thermal interaction by providing thermal insulation, allowing heat to be transferred from the interior components through the heat conductive layer while blocking the heat from reaching the user on the exterior side, thus resolving the temperature-related contradiction.
2Object-affected harmful factors
If multilayer housing with void layer is used, then user temperature safety is improved, but heat transfer efficiency from interior to exterior worsens
Solution Approach 1:
Different regions of the housing structure are assigned different thermal properties: the inner layer has high thermal conductivity for efficient heat transfer from components, while the intermediate void layer has low thermal conductivity for insulation. This local differentiation of material properties allows simultaneous achievement of heat transfer efficiency in the inner region and user safety in the outer region.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat transfer from electronic devices to the environment, maintaining a desired operational temperature and preventing user exposure to high temperatures, as demonstrated by the multilayer housing structure that incorporates a void layer to enhance heat migration.
Implementation Method 1
multilayer housings as described herein transfer heat from an electronic device to an environment surrounding the electronic device
Implementation Method 2
maintain a desired operational temperature from the perspective of an end user due at least in part the presence of a void layer
Data Source
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AI summary
Example implementations relate to multilayer housings. In one example, multilayer housing can include a first continuous layer comprising copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof, a void layer on the first continuous layer, wherein the void layer comprises from (5) volume percent (vol. %) to (95) vol. % voids; and a second continuous layer on the void layer, wherein the second continuous layer comprises copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof.