Multilayer IC Socket with Spring Probes for Signal Integrity
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Solution Overview
Problem
Traditional IC sockets face mechanical and electrical limitations, such as increased terminal count, reduced terminal pitch, and signal integrity issues, which are exacerbated by the self-heating of power-delivering contacts and cross-talk between adjacent contact members, making them unsuitable for next-generation IC devices operating above 5 GHz.
Innovation Solution
A high-performance electrical interconnect with a multilayered substrate and spring probe contact members that eliminates the need for solder balls, reduces terminal pitch without an interposer, and incorporates grounding schemes, shielding, and passive/active circuit features, enabling fine line high-density circuit structures and reducing production complexity and environmental impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If terminal pitch is decreased to increase terminal count, then more terminals can be accommodated, but insulating wall thickness decreases and manufacturing difficulty increases
Solution Approach 1:
The housing is divided into multiple layers (first housing layer, second housing layer) with different functions. The first layer provides structural support and insulation, while the second layer contains the contact members. This segmentation allows independent optimization of each layer's thickness and properties, enabling high terminal count while maintaining adequate insulating wall thickness in the structural layer.
Solution Approach 2:
The patent transitions from a traditional single-layer housing to a multilayer structure with vertical stacking. By utilizing the vertical dimension, the design accommodates more terminals horizontally while maintaining sufficient insulating wall thickness in the vertical direction, effectively decoupling terminal count from wall thickness constraints.
2Reliability
If contact member length is increased to optimize spring properties, then contact reliability improves, but signal integrity decreases due to self-heating
Solution Approach 1:
The contact members are constructed from copper alloy materials that provide optimal electrical conductivity and mechanical spring properties. The use of composite material structures (copper alloy with specific properties) allows achieving both long contact length for reliability and low self-heating through superior electrical conductivity, resolving the contradiction between contact reliability and signal integrity.
3Area of stationary object
If insulating wall thickness is decreased to reduce package size, then terminal pitch can be reduced, but cross-talk between adjacent contact members increases
Solution Approach 1:
The housing is segmented into multiple layers with the first layer providing thick insulating walls for structural support and electrical isolation, while the second layer contains the contact members. This segmentation allows the overall package size to be reduced through compact vertical stacking while maintaining adequate insulating wall thickness to prevent cross-talk between adjacent contacts.
4Ease of manufacture
If traditional IC socket design is used for next generation IC devices, then manufacturing experience is leveraged, but electrical performance limits are reached above 5 GHz
Solution Approach 1:
The patent modifies key design parameters including housing structure (multilayer), contact member configuration (spring-loaded with specific geometry), and material selection (copper alloy) to optimize electrical performance for high-frequency applications above 5 GHz. These parameter changes maintain manufacturability through established molding and assembly processes while achieving the required electrical performance for next-generation IC devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides reliable, low-profile, solder-free connections with improved signal integrity and reduced costs, enabling the use of next-generation IC devices while simplifying IC device and PCB designs and reducing environmental impact.
Implementation Method 1
The inner walls of the core may be metalized to provide an impedance tuning effect
Data Source
AI summary
A electrical interconnect adapted to provide an interface between contact pads on an IC device and a PCB. The electrical interconnect includes a multi-layered substrate with a first surface with a plurality of first openings having first cross-sections, a second surface with a plurality of second openings having second cross-sections, and center openings connecting the first and second openings. The center openings include at least one cross-section greater than the first and second cross-sections. A plurality of spring probe contact members are located in the center openings. The contact members include first contact tips extending through the first opening and above the first surface, second contact tips extending through the second openings and above the second surface, and center portions located in the center openings. The center portions include a shape adapted to bias the first and second contact tips toward the IC device and PCB, respectively. A dielectric material different from the material of the substrate is located in at least one of the first opening, the second opening, or the center opening.