Multilayer Inductor Asymmetric End Surface Layers

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Solution Overview

Problem

Multilayer inductors face mechanical strength issues during reflow soldering and deflection tests, leading to distortion and warpage, as their existing compositions do not adequately enhance structural integrity.

Innovation Solution

A multilayer inductor design with a non-conductive component main body featuring a thicker first end surface layer and a thinner second end surface layer, where the first end surface layer has higher rigidity and is thicker than the second, to improve mechanical strength without increasing the inductor's size, and includes a coil conductor with exposed terminal electrodes for reliable mounting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the component main body uses a uniform multilayer structure, then the manufacturing process is simple, but the mechanical strength is insufficient during reflow soldering and deflection tests

Engineering Contradiction:
Improvemechanical strengthVSAvoidstructure complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent applies local quality by creating a multilayer structure where the first end surface layer has different properties (higher rigidity and greater thickness) compared to the second end surface layer. This localized differentiation strengthens the component at the first end surface to prevent distortion and warpage during reflow soldering and deflection tests, while maintaining manufacturability through a controlled lamination process.

Inventive Principle:
Principle #3Local quality

2Stability of the object's composition

If the first end surface layer is made thicker and more rigid, then distortion and warpage are reduced, but the component size increases

Engineering Contradiction:
Improvedimensional stabilityVSAvoidcomponent size
Core Design Contradiction:
Stability of the object's compositionVSVolume of moving object

Solution Approach 1:

The patent implements local quality by concentrating the enhanced rigidity and thickness only at the first end surface layer, rather than uniformly increasing the dimensions of the entire component. This localized approach improves dimensional stability and reduces distortion during processing while minimizing the overall increase in component size.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent applies segmentation by dividing the component main body into multiple functional layers with distinct properties. The first end surface layer is segmented to have greater thickness and higher rigidity, while the second end surface layer maintains standard dimensions. This segmentation allows the component to achieve improved dimensional stability without a proportional increase in overall volume.

Inventive Principle:
Principle #1Segmentation

3Reliability

If the multilayer structure is optimized for mechanical strength, then cracking is prevented during processing, but the electrical characteristics may be affected

Engineering Contradiction:
Improvecrack resistanceVSAvoidelectrical characteristic degradation
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent applies local quality by optimizing only the first end surface layer for mechanical strength with greater thickness and higher rigidity, while keeping the second end surface layer and internal structure designed for electrical performance. This localized optimization prevents cracking during reflow soldering and deflection tests while maintaining the electrical characteristics of the inductor.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent segments the component main body into layers with differentiated functions: the first end surface layer is optimized for mechanical strength to prevent cracking, while the second end surface layer and internal layers are designed to preserve electrical characteristics. This functional segmentation resolves the contradiction between crack resistance and electrical performance.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11621116B2Multilayer inductor
Publication Date: 2023.04.04 MURATA MFG CO LTD
  • US11621116B2 patent drawing
  • US11621116B2 patent drawing
  • US11621116B2 patent drawing

AI summary

A component main body has end surface layers having a relatively high rigidity and a low-strength layer having a relatively low rigidity. The end surface layer includes a first end surface layer configuring a first end surface of the component main body, and a second end surface layer configuring a second end surface. A thickness of the first end surface layer is made thicker than a thickness of the second end surface layer. When the thickness of the first end surface layer is made larger than the thickness of the second end surface layer under a condition that a total thickness is constant, the thickness of the first end surface layer can be thickened as compared to a case where both of the thicknesses are equal to each other. Such thickened first end surface layer can give high mechanical strength to the component main body.