Multilayer Electronic Component Inductor Capacitor Layout
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Solution Overview
Problem
Surface-mounted electronic components with a specific internal structure experience degradation in coil characteristics due to magnetic flux interference from land electrodes and ground conductor layers on the circuit board, leading to eddy current issues.
Innovation Solution
An electronic component design featuring a multilayer body with a spiral inductor and capacitor configuration, where the capacitor conductor layers are positioned closer to the mounting surface than the inductor conductor layers, and both have a two-fold rotational symmetrical structure, minimizing magnetic flux interference and eddy currents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the coil is positioned on the lower layer sheet side to enable surface mounting, then the mounting surface is formed, but the magnetic flux is blocked by land electrodes and ground conductor layers causing eddy current and degradation of coil characteristics
Solution Approach 1:
The patent positions the coil on the upper layer sheet side rather than the lower layer sheet side, utilizing the vertical dimension (layer stacking direction) to relocate the coil away from the mounting surface. This dimensional repositioning allows the magnetic flux to extend laterally without being blocked by land electrodes and ground conductor layers on the circuit board, thereby preventing eddy current while maintaining surface mounting capability through the lower layer sheet side.
2Volume of moving object
If the coil and capacitor are positioned close together to achieve miniaturization, then the component size is reduced, but magnetic flux interference and eddy current increase
Solution Approach 1:
The patent utilizes the vertical dimension by positioning the coil and capacitor on different layer sheets (coil on upper layer, capacitor on lower layer). This layered arrangement allows the components to be physically close in plan view for miniaturization while the vertical separation and different positioning prevent magnetic flux interference and eddy current generation.
Solution Approach 2:
The patent employs asymmetric positioning where the coil is positioned at a specific location on the upper layer sheet and the capacitor at a different location on the lower layer sheet, rather than symmetrically overlapping. This asymmetric arrangement optimizes the magnetic flux path to avoid land electrodes and ground conductor layers while maintaining compact dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses degradation in inductor characteristics by reducing magnetic flux interference and eddy currents, maintaining consistent inductance and Q values, and allowing for miniaturization while achieving similar performance to discrete LC parallel resonators.
Implementation Method 1
the coil has a substantially spiral shape when viewed from above, and thus produces a magnetic flux extending in the upper-lower direction
Implementation Method 2
The magnetic flux is thus blocked by land electrodes, ground conductor layers, and the like provided on the circuit board, leading to the risk of eddy current arising in the land electrodes, ground conductor layers, and the like
Data Source
AI summary
The electronic component includes a substantially rectangular parallelepiped multilayer body formed by laminating a plurality of insulation layers, a capacitor including a plurality of capacitor conductor layers provided on the insulation layers, and a substantially spiral-shaped inductor including one or more inductor conductor layers provided on the insulation layers and having a center axis extending along the lamination direction. A mounting surface of the multilayer body is a surface of the multilayer body located on the end of one side of a first orthogonal direction orthogonal to the lamination direction. The inductor conductor layer and the capacitor conductor layer are provided on the first insulation layer. On the first insulation layer, an end portion of the capacitor conductor layer on the one side of the first orthogonal direction are closer to the mounting surface than an end portion of the inductor conductor layer on the one side of the first orthogonal direction.