Multilayer Inductor Layout for High-Q Compact Branching Filters

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Solution Overview

Problem

Existing multilayer electronic components face challenges in downsizing while maintaining a high Q value for inductors, as downsizing often leads to a decrease in Q value and increased size due to the configuration of via hole conductors in branching filters and similar components.

Innovation Solution

A multilayer electronic component design featuring inductors wound about orthogonal axes with specific conductor layer configurations and through hole column connections, allowing for parallel connections near the ends of conductor layers to increase Q value while minimizing size, including a stack of dielectric layers with inductors L11, L12, L13, L21, and L22 arranged to optimize space and electromagnetic coupling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If an inductor is downsized along with downsizing of the branching filter, then the size of the branching filter is reduced, but the Q value of the inductor decreases

Engineering Contradiction:
Improvesize of branching filterVSAvoidQ value of inductor
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent utilizes the stacking direction (vertical dimension) to arrange multiple dielectric layers and conductor layers, transforming the traditional planar inductor layout into a three-dimensional stacked structure. This allows the inductor to maintain its electrical performance and Q value while reducing the horizontal footprint and overall size of the branching filter.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent embeds multiple functional elements within a compact stacked architecture, where conductor layers and dielectric layers are nested together in sequence. The inductor structure itself is nested within the multilayer configuration, with via hole conductors connecting different levels, creating a space-efficient nested arrangement that preserves Q value while minimizing size.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Reliability

If a plurality of via hole conductors are connected to one end of the conductor layer to increase Q value, then the Q value of the inductor is increased, but the size of the branching filter increases

Engineering Contradiction:
ImproveQ value of inductorVSAvoidsize of branching filter
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

Instead of extending via hole conductors horizontally along the conductor layer (planar arrangement), the patent connects multiple via hole conductors to different ends of the conductor layer through vertical stacking. This three-dimensional arrangement allows multiple connections without increasing the horizontal footprint, thereby maintaining a compact size while achieving the desired Q value enhancement.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent divides the inductor structure into multiple discrete conductor layers and dielectric layers, with via hole conductors strategically positioned at different locations and levels. This segmentation allows the via hole conductors to be distributed throughout the stacked structure rather than concentrated at one end, increasing Q value while maintaining compact dimensions.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design achieves a higher Q value for each inductor while downsizing the electronic component, reducing unnecessary space and preventing electromagnetic coupling among inductors, thus enhancing the component's performance and compactness.

Implementation Method 1

preventing electromagnetic coupling among inductors

Methodology Applied
Scientific EffectElectromagnetic coupling: Electromagnetic Induction

Data Source

PatentUS11863150B2Multilayer electronic component
Publication Date: 2024.01.02 TDK CORP
  • US11863150B2 patent drawing
  • US11863150B2 patent drawing
  • US11863150B2 patent drawing

AI summary

An electronic component includes a stack and first to fourth inductors. The second inductor is disposed after the first inductor in a −Y direction. The third inductor and the fourth inductor are disposed after the first inductor and the second inductor, respectively, in a −X direction. Two or more through hole columns are connected in parallel to a part near each end of a conductor layer portion in each of the first inductor and the fourth inductor in a longitudinal direction. One through hole column is connected to a part near each end of a conductor layer portion in each of the second inductor and the third inductor in a longitudinal direction.