Multilayer Inductor Layout for Stable Characteristics Under Sheet Displacement

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Solution Overview

Problem

Multilayer electronic components with stacked inductor conductor layers experience characteristic variations due to displacement of ceramic green sheets, leading to inconsistent performance.

Innovation Solution

A multilayer electronic component design featuring inductors wound about an axis orthogonal to the stacking direction, with through hole columns and conductor layers arranged in specific configurations to minimize displacement-related characteristic variations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If multiple inductor conductor layers having the same planar shape are stacked, then the inductor can be formed in a multilayer structure, but displacement of the conductor layers due to displacement of ceramic green sheets causes characteristic change of the inductor

Engineering Contradiction:

Improveinductor structureVSAvoidinductor characteristic

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The patent applies asymmetry by making the conductor layers have different planar shapes. Specifically, the first conductor layer has a first planar shape and the second conductor layer has a second planar shape that is different from the first planar shape. This asymmetric design ensures that even when displacement occurs during manufacturing, the overlapping area between layers remains controlled, preventing significant characteristic changes in the inductor.

Inventive Principle:

Principle #4Asymmetry

Solution Approach 2:

The patent applies local quality by optimizing the overlapping area between conductor layers at specific locations. The design ensures that the overlapping area between the first and second conductor layers is controlled to be 10% or more of the total area, providing sufficient magnetic coupling locally while maintaining manufacturing tolerance.

Inventive Principle:

Principle #3Local quality

2Ease of manufacture

If ceramic green sheets are stacked to form multilayer structure, then integration is achieved, but displacement during manufacturing causes characteristic variation

Engineering Contradiction:

Improvestacking processVSAvoidinductor characteristic stability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The asymmetric planar shapes of conductor layers provide a tolerance buffer against displacement. By designing the layers with different shapes rather than identical shapes, the patent ensures that small displacements during stacking do not result in complete misalignment, thereby maintaining reliable inductor characteristics despite manufacturing variations.

Inventive Principle:

Principle #4Asymmetry

Solution Approach 2:

The patent provides beforehand cushioning by designing the conductor layers with overlapping areas that accommodate expected displacement. The overlapping region acts as a cushion that absorbs the effect of displacement, ensuring that the inductor characteristics remain stable even when green sheets shift during the stacking process.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Data Source

PatentUS12620519B2Multilayer electronic component

Publication Date: 2026.05.05 TDK CORP

AI summary

An electronic component includes a stack and an inductor wound about an axis orthogonal to a stacking direction. The inductor includes a first conductor layer portion and two through hole columns. The first conductor layer portion includes two conductor layers disposed at positions different from each other in the stacking direction and connected in parallel to each other. Area of a first conductor layer is larger than area of a second conductor layer.