Multilayer Inductor Shield Layout for Controlled Coupling
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Solution Overview
Problem
The integration of a shield conductor with a multilayer electronic component, which includes inductors constituted by a conductor layer and a columnar conductor, leads to strengthened coupling between the columnar conductor and the shield, resulting in undesired characteristics, especially when multiple inductors are present.
Innovation Solution
A multilayer electronic component is designed with a stack of dielectric and conductor layers, where the shield conductor is integrated with the stack. The component includes a first inductor, a second inductor, and a third inductor, with the second inductor arranged between the first and third inductors. The shield conductor has a first conductor part on one side surface and a second conductor part on the opposite side surface, with specific connecting conductors linking the inductors to the shield conductor parts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shield conductor is integrated with the stack to suppress electromagnetic interference, then shielding effectiveness is improved, but coupling between the columnar conductor and shield is strengthened causing undesired characteristics
Solution Approach 1:
The shield conductor is divided into first and second conductor parts positioned on opposite side surfaces of the stack. This segmentation allows selective connection to columnar conductors, enabling suppression of electromagnetic interference while controlling coupling effects. The divided structure permits different connection configurations for different columnar conductors, resolving the contradiction between shielding effectiveness and characteristic performance.
Solution Approach 2:
Different connection configurations are applied to different columnar conductors based on their specific requirements. Some columnar conductors are connected to the first conductor part, others to the second conductor part, and some may be connected to both. This local differentiation allows optimization of each inductor's performance while maintaining overall shielding effectiveness, thus resolving the contradiction between electromagnetic interference suppression and characteristic performance.
2Adaptability or versatility
If multiple inductors are provided in the stack, then functionality is improved, but coupling between columnar conductors and shield conductor is strengthened causing performance degradation
Solution Approach 1:
The shield conductor is segmented into first and second conductor parts that can be selectively connected to different columnar conductors. This allows multiple inductors to coexist in the stack with controlled coupling relationships, enabling enhanced signal processing capability while preventing performance degradation from excessive coupling.
Solution Approach 2:
Each columnar conductor associated with an inductor can have its own specific connection configuration to the shield conductor's first or second conductor part. This local quality approach allows optimization of each inductor's characteristics while maintaining the functionality of multiple inductors in the stack, resolving the contradiction between versatility and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses the occurrence of issues caused by the shield conductor, allowing the multilayer electronic component to achieve desired characteristics by minimizing coupling between the inductors and the shield.
Implementation Method 1
a shield conductor constituted by a conductor and integrated with the stack
Implementation Method 2
an inductor constituted by a conductor layer and a columnar conductor
Data Source
AI summary
An electronic component includes a stack, a first inductor, a second inductor, a third inductor, and a shield conductor. The shield conductor includes a first conductor part provided on a side surface of the stack and a second conductor part provided on a side surface of the stack. The electronic component further includes a first connecting conductor that connects two columnar conductors of the first inductor and the first conductor part, a second connecting conductor that connects two columnar conductors of the second inductor and the second conductor part, and a third connecting conductor that connects two columnar conductors of the third inductor and the first conductor part.