Multilayer Inductor Side Parts for High Inductance and Low Defect Rate
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Solution Overview
Problem
Multilayer inductors face challenges in preventing internal coil exposure and achieving high inductance due to electrode exposure defects and increased delamination rates during the manufacturing process, which limits their performance.
Innovation Solution
A multilayer electronic component design featuring a multilayer body with internal coil patterns exposed to side surfaces, covered by thermosetting resin-based side parts containing dielectric or ferrite fillers, which are attached to the side surfaces to prevent exposure and enhance inductance, along with a manufacturing method involving the formation and cutting of insulation sheets to create individual components with maximum internal coil area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If internal coil patterns are exposed to side surfaces to increase inductance, then inductance is improved, but electrode exposure defects and delamination rates increase
Solution Approach 1:
The patent transitions from a two-dimensional planar structure to a three-dimensional structure by adding side parts that wrap around the side surfaces. This dimensional change allows the internal coil patterns to be exposed to side surfaces for increased inductance while the side parts simultaneously cover and protect these exposed areas, preventing electrode exposure defects and delamination.
Solution Approach 2:
The side parts are constructed using composite materials consisting of thermosetting resin combined with dielectric materials (such as Al2O3, TiO2, SiO2) and/or ferrite materials. This composite structure provides both the mechanical protection needed to prevent defects and the electromagnetic properties needed to maintain high inductance performance.
2Power
If margin portions are removed to maximize internal coil area, then inductance is improved, but manufacturing precision and reliability deteriorate
Solution Approach 1:
By adding the side parts that wrap around the side surfaces, the patent enables the removal of margin portions from the end surfaces while maintaining reliability. The side parts provide the necessary protection and structural integrity that would otherwise be provided by the margin portions, allowing maximum internal coil area without compromising manufacturing precision.
3Reliability
If side parts are added to cover side surfaces, then reliability is improved, but device complexity increases
Solution Approach 1:
The side parts serve multiple functions simultaneously: they cover the side surfaces to prevent electrode exposure defects, provides mechanical protection against delamination, and maintain structural integrity. By combining these multiple functions into a single component, the patent improves reliability without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents internal coil exposure and reduces delamination defects, allowing for increased internal coil area and high inductance implementation without the need for margin portions, thereby enhancing the component's performance.
Implementation Method 1
The first and second side parts may contain a thermosetting resin
Implementation Method 2
The first and second side parts may further contain at least one filler selected from the group consisting of a dielectric material and ferrite
Implementation Method 3
The first and second side parts may further contain at least one filler selected from the group consisting of a dielectric material and ferrite
Implementation Method 4
vias penetrating through the insulation layers and connecting the plurality of internal coil patterns to each other
Data Source
AI summary
A multilayer electronic component includes a multilayer body having a structure in which a plurality of insulation layers are stacked, and having first and second end surfaces opposing each other and first and second side surfaces connecting the first and second end surfaces to each other. An internal coil disposed in the multilayer body includes a plurality of internal coil patterns exposed to the first and second side surfaces of the multilayer body and vias penetrating through the insulation layers connecting the plurality of internal coil patterns to each other. First and second side parts cover at least portions of the first and second side surfaces of the multilayer body, respectively.