Multilayer Inductor Outer Coil Silver Layer

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Solution Overview

Problem

High-frequency multilayer inductors face increased equivalent series resistance due to parasitic capacitance and magnetic flux loss, leading to a deteriorated Q factor, especially at higher frequencies.

Innovation Solution

A multilayer electronic component design featuring a material layer with lower specific resistance than the internal coil parts, made of silver, is applied to the outermost internal coil parts, and external electrodes are formed on the end surfaces or bottom surface of the multilayer body to reduce parasitic capacitance and magnetic flux loss, improving the Q factor.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the interlayer distance between coils and the distance between the coil and external electrodes are decreased to reduce component size, then the compactness is improved, but the equivalent series resistance increases due to parasitic effect and increased parasitic capacitance

Engineering Contradiction:
Improvecomponent sizeVSAvoidequivalent series resistance
Core Design Contradiction:
Volume of moving objectVSLoss of energy

Solution Approach 1:

The patent applies different materials with different properties to different locations: low-specific-resistance material is applied specifically to the outermost internal coil part where parasitic effects are most severe, while internal coil parts maintain their original conductive paste material. This localized material differentiation reduces AC resistance at critical locations without increasing overall component size.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent uses composite material structure combining conductive paste (for internal coils) with low-specific-resistance material (for outermost coil). This composite approach leverages the advantages of both materials: the conductive paste provides adequate conductivity for internal structures, while the low-specific-resistance material reduces AC resistance and parasitic effects at the external interface.

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If a conventional conductive paste is used for internal coil parts, then the manufacturing process is simple, but the AC resistance increases at high frequency due to skin effect

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidAC resistance
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The patent applies low-specific-resistance material specifically to the outermost internal coil part where current density is highest and skin effect is most pronounced. Internal coil parts continue to use conventional conductive paste, maintaining manufacturing simplicity while reducing AC resistance at the critical external interface where performance is most impacted.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent changes the specific resistance parameter of the material at the outermost coil position from conventional conductive paste levels to lower values by applying low-specific-resistance material. This parameter change directly addresses the skin effect and reduces AC resistance without complicating the overall manufacturing process.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively decreases AC resistance and enhances the Q factor by minimizing signal congestion and loss, resulting in improved inductance and equivalent series resistance performance.

Implementation Method 1

The AC resistance increases due to a skin effect resulting from an increase in the AC frequency and a parasitic effect

Methodology Applied
Scientific EffectSkin effect: Skin Effect

Implementation Method 2

equivalent series resistance may increase in a high frequency region due to a loss of magnetic flux and parasitic capacitance generated between internal metals or between internal and external metals

Methodology Applied
Scientific EffectParasitic capacitance: Parasitic Capacitance

Data Source

PatentUS10170241B2Multilayer electronic component and method of manufacturing the same
Publication Date: 2019.01.01 SAMSUNG ELECTRO MECHANICS CO LTD
  • US10170241B2 patent drawing
  • US10170241B2 patent drawing
  • US10170241B2 patent drawing

AI summary

A multilayer electronic component includes: a multilayer body includes stacked insulating layers and internal coil parts disposed on the insulating layers; external electrodes disposed on an outer portion of the multilayer body and connected to the internal coil parts; and a material layer disposed on an outermost coil part among the internal coil parts and having a specific resistance that is lower than a specific resistance of the internal coil parts.