Multilayer Inductor Via Hole Non-Magnetic Material Parasitic Inductance
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Solution Overview
Problem
Multilayer devices with magnetic-member substrates face issues of increased parasitic inductance due to conductor placement, which can lead to potential differences in GND terminal potentials and reduced mounting regions for electronic components.
Innovation Solution
A multilayer device design featuring a via hole in the magnetic member layer that connects land electrodes on opposite surfaces, with a non-magnetic material intervening between the via hole and the end surface, reducing parasitic inductance and allowing for flexible wiring pattern routing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a via hole is formed to electrically connect mounting electrodes penetrating through the magnetic member, then electrical connection between front and rear surfaces is achieved, but parasitic inductance increases
Solution Approach 1:
A non-magnetic member is introduced as an intermediary substance filling the via hole, positioned between the conductor and the magnetic member. This non-magnetic material acts as a mediator that prevents magnetic flux from concentrating around the via hole conductor, thereby reducing parasitic inductance while maintaining the electrical connection function between mounting electrodes on opposite surfaces.
2Object-generated harmful factors
If an end surface electrode is formed to connect upper and lower surfaces, then parasitic inductance is reduced, but a recessed portion must be provided reducing the mounting region
Solution Approach 1:
The via hole structure is segmented into multiple functional zones: an upper portion filled with non-magnetic material for inductance reduction, a conductor portion for electrical connection, and positioning that allows the non-magnetic material to contact the via hole wall. This segmentation enables the via hole to simultaneously achieve low parasitic inductance and maintain full surface mounting capability without requiring recessed portions.
3Reliability
If the via hole is positioned near the center of each side of the magnetic-member substrate, then electrical connection is achieved, but the degree of freedom for routing wiring patterns is limited
Solution Approach 1:
The positioning parameters of the via hole are made flexible rather than fixed at the center. The via hole can be positioned at arbitrary locations including corners or edges of the magnetic-member substrate, as long as it remains within a predetermined distance from an end surface. This parameter change enables optimal positioning for both electrical connection and wiring pattern routing freedom.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces parasitic inductance while maintaining a region for mounting electronic components and simplifying the wiring pattern, comparable to using an end surface electrode without the need for a recessed portion.
Implementation Method 1
the non-magnetic material that makes contact with the via hole is interposed between the via hole and the end surface of the multilayer device. Accordingly, parasitic inductance of the multilayer device of the present invention can be made smaller
Data Source
AI summary
A multilayer inductor device in which parasitic inductance is made smaller while preventing increase in a mounting area of the device and complexity of a wiring pattern, and a manufacturing method of the stated multilayer inductor device. An outer electrode and a terminal electrode are connected to each other through a via hole. A side surface of a non-magnetic member forms a part of an end surface of the device, while the other side surface thereof being in contact with the via hole. A side surface of the via hole that makes contact with the non-magnetic member is opened, which prevents the parasitic inductance from being increased. The via hole being provided in an arbitrary position makes it possible to prevent the wiring pattern from being complicated and a mounting area of the device from being increased.