Multilayer Input Sensor Structure for Uniform Sensitivity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic devices face challenges in achieving improved input sensor efficiency and display quality, particularly in devices with input sensors that utilize capacitive and electromagnetic induction methods.
Innovation Solution
The electronic device incorporates a multi-layered input sensor structure with specific insulation and conductive pattern layers, including silicon-based and organic materials, and a unique electrode configuration to enhance sensing performance and reduce defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multi-layered input sensor structure with multiple conductive pattern layers is used, then input sensor efficiency and sensing performance are improved, but device complexity increases
Solution Approach 1:
The input sensor is divided into multiple conductive pattern layers (first, second, third conductive pattern layers) separated by sensing insulation layers. Each layer performs specific sensing functions, allowing the system to achieve improved input sensor efficiency through functional segmentation while managing complexity through modular architecture.
Solution Approach 2:
Multiple conductive pattern layers are nested within each other at different depths, with each layer positioned between sensing insulation layers. This nested arrangement allows the sensor to achieve enhanced sensing performance through layered configuration while maintaining a compact overall structure that manages complexity.
2Reliability
If multiple conductive pattern layers are stacked with sensing insulation layers, then sensing performance is enhanced, but manufacturing precision requirements increase
Solution Approach 1:
Sensing insulation layers serve as intermediary layers between consecutive conductive pattern layers. These insulation layers provide a standardized interface that facilitates precise alignment and positioning of subsequent conductive patterns, thereby enhancing sensing performance while managing manufacturing precision requirements through a systematic layering approach.
Solution Approach 2:
The sensing insulation layers are formed beforehand to establish precise reference planes for subsequent conductive pattern deposition. This preliminary action ensures that each conductive pattern layer can be accurately positioned relative to previous layers, enhancing sensing performance while simplifying the manufacturing precision requirements through pre-established alignment references.
3Reliability
If silicon-based inorganic materials are used for sensing insulation layers, then electrical insulation is improved, but manufacturing complexity increases
Solution Approach 1:
The patent employs a composite structure combining silicon-based inorganic materials with organic materials in different sensing insulation layers. The silicon-based inorganic materials provide superior electrical insulation where needed, while organic materials provide flexibility and ease of manufacture in other regions, achieving both improved electrical insulation and manageable manufacturing complexity through material composition.
Solution Approach 2:
Different sensing insulation layers use different material compositions (silicon-based inorganic materials in some layers, organic materials in others) based on local requirements. This local quality approach allows the patent to achieve improved electrical insulation in critical areas while maintaining ease of manufacture in other areas, balancing performance and manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multi-layered input sensor structure improves input sensor efficiency and reduces defects, maintaining uniform sensitivity and enhancing display quality by minimizing resistive and out-gassing issues.
Implementation Method 1
The input sensor may sense an external input using a capacitance method
Implementation Method 2
The input sensor may sense an external input using an electromagnetic induction method
Data Source
AI summary
An electronic device includes: a display panel including pixels and an encapsulation layer covering the pixels; and an input sensor on the display panel, wherein the input sensor includes: a first sensing insulation layer directly on the encapsulation layer; a first conductive pattern layer on the first sensing insulation layer; a second sensing insulation layer on the first sensing insulation layer and covering the first conductive pattern layer; a second conductive pattern layer on the second sensing insulation layer; a third sensing insulation layer on the second sensing insulation layer and covering the second conductive pattern layer; a third conductive pattern layer on the third sensing insulation layer; and a fourth sensing insulation layer on the third sensing insulation layer and covering the third conductive pattern layer, and wherein the first conductive pattern layer and the second conductive pattern layer receive the same voltage.