Multilayer Electronic Component Insulating Layer Against Permeation
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in achieving miniaturization and high capacitance while maintaining reliability, as thinner internal electrodes and dielectric layers increase the risk of moisture and plating solution permeation, affecting their performance in compact electronic devices and automotive applications.
Innovation Solution
A multilayer electronic component design featuring dielectric layers and internal electrodes with a polymer resin insulating layer and plating layers, where the insulating layer extends to connection portions and the plating layers cover band portions, reducing the risk of moisture and plating solution permeation, and optimizing the thickness and placement of these layers to enhance capacitance and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the number of laminated layers is decreased by forming thin internal electrodes and dielectric layers, then miniaturization and high capacitance are achieved, but the risk of moisture and plating solution permeation increases
Solution Approach 1:
A resin-based insulating layer is applied to cover the internal electrodes at the end surfaces of the multilayer body. This thin film structure provides effective moisture and plating solution barrier protection without adding significant volume, enabling the component to maintain both miniaturization and high reliability against permeation.
2Quantity of substance
If the margin thickness is decreased to achieve miniaturization and high capacitance, then capacitance per unit volume increases, but permeation of external moisture or plating solution is facilitated
Solution Approach 1:
The resin-based insulating layer forms a protective thin film over the internal electrodes, creating an effective barrier against moisture and plating solution permeation. This allows the margin thickness to be minimized for high capacitance density while the insulating layer compensates for the increased permeation risk.
Solution Approach 2:
The insulating layer is formed using a resin material that may include inorganic particles, creating a composite structure that provides both mechanical protection and chemical resistance. This composite approach enhances the barrier properties against moisture and plating solution while maintaining the thin profile needed for high capacitance per unit volume.
3Area of stationary object
If thin internal electrodes and dielectric layers are formed to reduce the number of laminated layers, then mounting space is reduced, but reliability deteriorates due to increased permeation risk
Solution Approach 1:
The resin-based insulating layer provides a protective barrier that prevents moisture and plating solution from penetrating to the internal electrodes. This thin film structure adds minimal mounting space while significantly improving reliability by blocking permeation pathways.
Data Source
AI summary
A multilayer electronic component includes: a body having first and second surfaces opposing each other in a first direction and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second external electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed on the second surface to extend to portions of the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The insulating layer includes a polymer resin.