Multilayer Intermediate Circuit Board for Inverter
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Solution Overview
Problem
Existing intermediate circuit arrangements in inverters require complex connection technologies to manage high currents and often involve structurally different capacitor banks, increasing the number of components and complexity.
Innovation Solution
The use of structurally identical partial circuit boards with terminal strips and a multilayer connecting circuit board with specific metal layer configurations allows for easy and low-impedance connections between capacitor banks, enabling efficient and reliable high-current handling with fewer components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If capacitor banks are arranged on different printed circuit boards, then the required capacitance values can be achieved, but the structural complexity increases and the number of different components increases
Solution Approach 1:
The intermediate circuit arrangement is divided into multiple partial circuit boards, each containing capacitor banks. These partial circuit boards are connected in parallel to achieve the required total capacitance while maintaining manageable individual board designs. The segmentation allows distribution of capacitance across multiple identical or similar modular units.
Solution Approach 2:
The patent employs structurally identical partial circuit boards that can be used universally in different positions within the intermediate circuit arrangement. Each partial circuit board serves the same function (providing capacitance), and their identical design reduces the number of different components needed, simplifying manufacturing and assembly while still achieving the required total capacitance through parallel connection.
2Power
If high currents flow through the connections of the intermediate circuit arrangement, then the power handling capability is improved, but complex connection technology is required
Solution Approach 1:
Multiple identical connection paths are merged in parallel between the partial circuit boards. Each partial circuit board connects to the others through corresponding terminal strips with identical connection technology. This merging of multiple parallel connection paths enables high current handling capability while using simple, standardized connection methods at each individual connection point.
Solution Approach 2:
The connection technology used between all partial circuit boards is made homogeneous - the same terminal strip design, same connection method, and same structural approach are applied uniformly across all connections. This homogeneity simplifies the connection technology required, as only one type of connection needs to be mastered and manufactured, while the parallel arrangement of these identical connections provides the necessary high current capacity.
3Adaptability or versatility
If capacitor banks are connected in series to provide intermediate voltage values, then the voltage level capability is improved, but the number of connection points and complexity increases
Solution Approach 1:
The patent implements a nested structure where series-connected capacitor banks within partial circuit boards are combined with parallel connections between multiple identical partial circuit boards. This nested arrangement of series and parallel connections enables multiple voltage levels to be provided through the terminal strips while reusing the same structural pattern across all units, reducing overall complexity.
Data Source
AI summary
A disclosed intermediate circuit arrangement includes first and second partial circuit boards of identical design having a series circuit of at least two capacitor banks. The partial circuit boards each have a terminal strip having a positive intermediate circuit connection, a negative intermediate circuit connection, and a central connection. The circuit arrangement also includes a connecting circuit board for electrically connecting the respective connections of the terminal strips of the two partial circuit boards to one another. The connecting circuit board is a multi-layer circuit board with two outer metal layers and at least two inner metal layers arranged between the outer metal layers. The outer metal layers have an electric connection between corresponding connections of the terminal strips of the two partial circuit boards, and at least one first metal layer of the inner metal layers has only an electrical connection of the positive intermediate circuit connections of the two partial circuit boards and at least one second metal layer of the inner metal layers has only an electrical connection of the negative intermediate circuits of the two partial circuit boards. The intermediate circuit arrangement can be part of an inverter.