Multilayer Interposer Assembly for High-Density Chip Stacking
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges in achieving high-density microelectronic assemblies with vertical integration of components, as existing packaging techniques struggle to efficiently integrate semiconductor chips into smaller form factors while maintaining performance and reliability.
Innovation Solution
A multilayer structure is proposed, comprising multiple interposers and electronic components arranged in stacked layers, where each layer includes at least one electronic component between two interposers, with electrical connections to a package substrate and circuit board, enabling efficient vertical integration and enhanced connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional packaging techniques are used to integrate semiconductor chips, then manufacturing processes are simpler, but integration density and device size reduction are limited
Solution Approach 1:
The patent transitions from traditional planar 2D packaging to a 2.5D/3D vertical stacking architecture. Multiple interposer layers (first interposer, second interposer) are stacked vertically with electronic components positioned between them, enabling high-density integration by utilizing the vertical dimension rather than only horizontal expansion.
2Quantity of substance
If minimum feature size is continuously reduced to increase integration density, then more components can be integrated, but manufacturing precision requirements increase
Solution Approach 1:
The patent divides the integrated circuit into multiple functional modules mounted on separate interposer layers. Each interposer (first interposer, second interposer) carries specific electronic components, allowing independent fabrication and testing of modules before final assembly. This segmentation enables relaxed manufacturing precision requirements for individual modules while achieving high overall integration density.
3Volume of moving object
If vertical integration of components is implemented, then device size is reduced, but electrical connectivity and signal integrity become more challenging
Solution Approach 1:
The patent introduces interposers as intermediary substrates between electronic components and the final package substrate. These interposers provide controlled impedance pathways, signal routing, and electrical connection management. The first and second interposers act as mediators that maintain signal integrity while enabling vertical stacking, solving the connectivity challenges inherent in 3D integration.
4Productivity
If multiple interposer layers are stacked vertically, then integration density increases, but device complexity and assembly difficulty increase
Solution Approach 1:
The patent employs preliminary assembly and testing of electronic components on individual interposer layers before final vertical stacking. Each interposer is prepared separately with its designated components, allowing quality verification and connection validation prior to integration. This preliminary action simplifies the overall assembly process despite the complex multilayer structure.
Data Source
AI summary
A multilayer structure including a plurality of interposers and a plurality of electronic components disposed between the plurality of interposers is provided. The plurality of interposers and the plurality of electronic components are arranged in at least two layers, each layer comprising at least one electronic component of the plurality of electronic components disposed between two interposers of the plurality of interposers. The at least two layers are stacked adjacent to one another such that one interposer of the plurality of interposers is common to adjacent layers of the at least two layers. A first external terminal and a second external terminal may electrically connect the multilayer structure with an additional electronic component and/or within an assembly. Microelectronic assemblies incorporating a multilayer structure are also provided.