Multilayer Lamination Transfer Films for Electrical Stack Fabrication
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Solution Overview
Problem
There is a lack of effective continuous techniques for producing fully integrated multilayer electrical films, especially those with a large number of layers, such as over 100 layers, and existing thin film electrical devices often require multiple vapor deposition and patterning steps, which are complex and inefficient.
Innovation Solution
The use of multilayer lamination transfer films with electrical protolayers that include a combination of sacrificial and thermally stable materials, which can be laminated onto a receptor substrate and baked to form a dense electrical stack, allowing for the creation of complex electrical devices like electrochromic windows, photovoltaic devices, and energy harvesters.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple vapor deposition and patterning steps are used to produce thin film electrical devices, then electrical functionality can be achieved, but device complexity and manufacturing difficulty increase significantly
Solution Approach 1:
The patent divides the complex multilayer electrical structure into separate protolayers that are pre-formed on individual flexible substrates. Each protolayer contains specific electrical components (conductive layers, dielectric layers, functional layers) that can be independently fabricated and then transferred together as an integrated stack, reducing the number of sequential deposition and patterning steps required.
Solution Approach 2:
The patent performs preliminary fabrication of electrical protolayers on flexible substrates before final assembly. The protolayers are pre-patterned with conductive traces, electrodes, and functional materials while on the substrate, allowing complex electrical structures to be prepared in advance and then transferred as complete functional units rather than building layer-by-layer during final assembly.
2Productivity
If continuous film-based methods are used for fabrication, then manufacturing efficiency improves, but producing fully integrated multilayer electrical films with large number of layers remains difficult
Solution Approach 1:
The patent combines multiple separate protolayers into a single integrated multilayer stack that functions as a complete electrical device. The protolayers are laminated together in sequence to form a consolidated structure containing numerous functional layers (conductive, dielectric, functional) that would otherwise require multiple separate fabrication processes, enabling continuous manufacturing of complex integrated devices.
Solution Approach 2:
The patent uses flexible substrates as intermediary carriers for the protolayers. These substrates allow the protolayers to be handled, transported, and assembled in a continuous manufacturing process. The substrates serve as temporary support structures that enable easy manipulation of thin electrical layers during the lamination and transfer process without requiring complex handling equipment.
3Reliability
If protolayers with high sacrificial material content are used, then complete removal of sacrificial material is achieved, but structural integrity during processing may be compromised
Solution Approach 1:
The patent creates composite protolayer structures combining sacrificial material with thermally stable materials. The thermally stable materials provide structural framework and mechanical strength during processing, while the sacrificial material fills remaining volume and can be completely removed by thermal decomposition. This composite approach allows high sacrificial material content (for complete removal) while maintaining structural integrity through the thermally stable component network.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of large-area, durable inorganic electrical devices with improved efficiency by allowing for the formation of complex electrical stacks with precise control over layer thickness and composition, reducing the need for multiple deposition steps and enhancing the integration of multiple layers.
Implementation Method 1
baking out sacrificial material to form an electrical stack
Implementation Method 2
high temperature step that removes sacrificial material and densifies thermally stable material
Data Source
AI summary
Transfer films, articles made therewith, and methods of making and using transfer films to form an electrical stack are disclosed. The transfer films may include a plurality of co-extensive electrical protolayers forming an electrical protolayer stack, at least selected or each electrical protolayer independently comprising at least 25 wt % sacrificial material and a thermally stable material and having a uniform thickness of less than 25 micrometers. The transfer films may include a plurality of co-extensive electrical protolayers forming an electrical protolayer stack, at least selected or each protolayer independently exhibiting a complex viscosity of between 103 and 104 Poise at a shear rate of 100/s when heated to a temperature between its Tg and Tdec.