Multi-Layer Laser Drilling with Layer-Specific Pulse Control
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Solution Overview
Problem
Standard laser drilling methods often result in cracks at the interfaces of multiple-layer components due to differences in material properties, which is a challenge that existing technologies have not effectively addressed.
Innovation Solution
The method involves controlling laser pulses by setting different frequencies, pulse durations, and pulse shapes for each layer to minimize or eliminate cracking, with the laser emitting device generating pulses with varying characteristics to drill through each material layer optimally.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If standard laser drilling methods are used on multi-layer components, then drilling efficiency is maintained, but cracks form at the interfaces between different material layers
Solution Approach 1:
The laser drilling process is segmented into multiple stages with different pulse parameters. The method divides the drilling process into: (1) pre-drilling stage with lower energy pulses to create an initial hole without excessive heating, (2) main drilling stage with higher energy pulses to complete penetration, and (3) cooling stage with reduced energy pulses to prevent crack formation at material interfaces. This segmentation allows optimization of each stage to balance productivity and reliability.
Solution Approach 2:
The invention employs periodic laser pulsing with varying parameters throughout the drilling process. Instead of continuous or uniform pulsing, the system periodically adjusts pulse duration, energy, and frequency based on the drilling depth and material layer being penetrated. This periodic variation in action parameters enables effective drilling while preventing thermal accumulation that causes interface cracking.
2Manufacturing precision
If uniform laser pulses are applied to all layers, then process simplicity is maintained, but material-specific optimal drilling cannot be achieved
Solution Approach 1:
The laser pulse parameters are made dynamic rather than static. The control system continuously adjusts pulse duration, energy level, and frequency based on real-time feedback and pre-programmed sequences corresponding to different material layers. This dynamic adaptation enables precise control for each layer's specific material properties while using a single laser device, managing complexity through software control rather than hardware complexity.
Solution Approach 2:
The invention systematically changes key laser parameters including pulse duration (from milliseconds to microseconds), pulse energy, and repetition frequency according to the specific material layer being drilled. Each material layer has optimized parameter sets that maximize drilling quality while minimizing thermal damage. This parameter change strategy achieves high manufacturing precision through controlled variation rather than complex device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively minimizes or eliminates cracks at the interfaces between different material layers, ensuring precise and crack-free drilling through components with multiple layers.
Implementation Method 1
drilling is performed by means of a laser emitting device
Implementation Method 2
generating at least one first layer pulse with a first pulse duration and a first pulse shape defining a varying energy level over time for drilling through a first layer
Data Source
Figure 1~2
Figure 3A
Figure 3B
AI summary
There is described herein a method OF and system for drilling holes in components (300) having multiple layers of materials using a laser emitting device (302) in combination with a control unit (304), by controlling the laser pulses in such a way that cracks at the interfaces between the various materials are minimized or eliminated.