Multilayer LC Resonant Circuit Board with Separated Current Paths
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing multilayer circuit boards with LC resonant circuits face signal degradation due to the sharing of wiring connections between inductors, capacitors, and resonators, which affects filter characteristics, especially when multiple resonators are connected.
Innovation Solution
A multilayer circuit board design that separates the path of resonant current through an interlayer via formed between layers in the resonant circuit, preventing the mixing of resonant current with the main signal line and enhancing resonance and signal attenuation characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If wiring connections are shared between inductors, capacitors, and resonators to reduce device complexity, then device complexity is reduced, but signal degradation occurs due to mixing of resonant current with main signal line
Solution Approach 1:
The patent segments the wiring connections by creating separate paths for resonant current and main signal current. The resonant circuit wiring is divided into distinct segments that connect only to the resonator components, while the main signal line remains separate. This segmentation prevents the mixing of currents and maintains signal integrity while still achieving a compact layout.
Solution Approach 2:
The patent extracts the resonant current path from the main signal line by forming separate wiring connections for the resonator. The resonant circuit is taken out as an independent current path that does not share conductors with the main signal, thereby eliminating the harmful interaction between resonant and signal currents while maintaining overall circuit functionality.
2Adaptability or versatility
If multiple resonators are connected to enhance frequency selection, then frequency selection capability is improved, but signal degradation accumulates due to shared wiring paths
Solution Approach 1:
Each resonator is connected through its own dedicated wiring path that is segmented from other resonators and the main signal line. This segmentation allows multiple resonators to be connected for enhanced frequency selection without the resonant currents of different resonators mixing with each other or with the main signal, preventing cumulative signal degradation.
Solution Approach 2:
The patent utilizes the interlayer via structure to create three-dimensional wiring paths for the resonators. By moving the connection paths to different layers and using vias for vertical connections, the resonators can be connected in a spatial arrangement that prevents current mixing while maintaining compact footprint, thus enabling multiple resonators without signal degradation.
3Productivity
If wiring length is reduced to improve high-frequency performance, then high-frequency performance is improved, but resonant current path separation becomes difficult
Solution Approach 1:
The patent uses interlayer vias to create vertical wiring paths that connect resonator components on different layers. This three-dimensional wiring approach allows for short connection lengths while maintaining separation between resonant current paths and main signal lines. The vias enable compact routing in the vertical dimension, achieving both short wiring length and path separation simultaneously.
Solution Approach 2:
The patent combines the resonator components and their wiring into an integrated structure where the resonator elements are positioned close to each other and connected through shared via structures. This merging reduces the overall wiring length while the careful design of the combined structure ensures that resonant current paths remain separated from the main signal line, maintaining high-frequency performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved resonance and signal attenuation characteristics, leading to enhanced frequency selection and high-frequency selectivity in filters, effectively addressing the signal degradation issue.
Implementation Method 1
separates a path through which a resonant current flows by an interlayer via formed between layers in a resonant circuit constituted by a capacitor and an inductor
Implementation Method 2
resonant circuit constituted by a capacitor and an inductor
Data Source
AI summary
A multilayer circuit board with an LC resonant circuit that has an electronic component package including the multilayer circuit board with the LC resonant circuit are provided. The multilayer circuit board with the LC resonant circuit configured by alternately laminating conductive layers and insulating resin layers on both sides of a core substrate includes a first set of wiring lines, a set of vias, and a second set of wiring lines. The first set of wiring lines configures both ends of the LC resonant circuit and is formed in a first one of the conductive layers. The set of vias extends through the insulating resin layers. The second set of wiring lines is connected to an input/output terminal of the LC resonant circuit and is formed in a second one of the conductive layers. The first set of wiring lines is connected to the second set of wiring lines.