Multilayer Magnetic Shield for DC and AC Field Attenuation
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Solution Overview
Problem
Current magnetic shields are ineffective in blocking both direct current (DC) and alternating current (AC) magnetic fields, which can disrupt microelectronic devices in harsh environments.
Innovation Solution
A magnetic shield comprising multiple layers, including a magnetic conductive material for attenuating DC fields and a non-magnetic conductive material for attenuating AC fields, with optional non-conductive layers to enhance eddy current attenuation, allowing for tailored thickness and configuration to effectively block a broad range of magnetic fields.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If magnetic conductive material thickness is increased, then DC field attenuation is improved, but device complexity increases
Solution Approach 1:
Instead of using a single thick magnetic layer, the shield segments the total thickness into multiple functional layers: a thinner magnetic conductive layer combined with a non-magnetic conductive layer. This segmentation achieves equivalent or superior DC attenuation while reducing overall complexity and enabling AC field protection.
2Object-affected harmful factors
If multiple layers are added to block both DC and AC fields, then magnetic field attenuation is improved, but device complexity increases
Solution Approach 1:
The non-magnetic conductive layer serves dual functions: it provides eddy current attenuation for AC fields while also contributing to the overall shield structure. This multi-functionality reduces the need for additional specialized layers, achieving broad frequency coverage without proportionally increasing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shield effectively attenuates both DC and AC magnetic fields across a wide frequency range, providing comprehensive protection for microelectronic devices in various environments by combining magnetic permeability and eddy current attenuation mechanisms.
Implementation Method 1
The first layer includes a magnetic conductive material... for attenuating DC magnetic fields
Implementation Method 2
the second layer includes a non-magnetic conductive material... for attenuating AC magnetic fields
Data Source
AI summary
A magnetic shield is presented. The shield may be used to protect a microelectronic device from stray magnetic fields. The shield includes at least two layers. A first layer includes a magnetic material that may be used to block DC magnetic fields. A second layer includes a conductive material that may be used to block AC magnetic fields. Depending on the type of material that the first and second layers include, a third layer may be inserted in between the first and second layers. The third layer may include a non-conductive material that may be used to ensure that separate eddy current regions form in the first and second layers.