Multilayer Electronic Component Marking for Uniform Plating
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Solution Overview
Problem
Existing multilayer electronic components face errors in direction identification due to incomplete plating of direction identification marks, as the underlayer is not sufficiently in contact with metal balls during electrolytic plating, leading to incorrect recognition by image recognizers.
Innovation Solution
A multilayer electronic component design with an external electrode on the surface, electrically connected to the circuit element and direction identification mark, allowing for sufficient plating layer formation through electrolytic plating, reducing thickness variations and errors in direction identification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the underlayer of the direction identification mark is formed only on the upper surface of the ceramic composite, then the structure is simple, but the underlayer cannot be sufficiently contacted with metal balls during electrolytic plating, resulting in insufficient plating layer thickness
Solution Approach 1:
The underlayer of the direction identification mark is extended from a two-dimensional surface pattern to a three-dimensional structure by forming it on a protruding portion that extends from the upper surface toward the lower surface of the ceramic composite. This dimensional change allows the underlayer to be contacted by metal balls during electrolytic plating, ensuring sufficient plating layer thickness while maintaining structural simplicity.
2Ease of manufacture
If the underlayer is not sufficiently contacted with metal balls during electrolytic plating, then the plating process is simple, but the plating layer thickness becomes insufficient and varies significantly
Solution Approach 1:
The underlayer is preliminarily formed on a protruding portion that extends from the upper surface toward the lower surface of the ceramic composite before the electrolytic plating process. This preliminary structural preparation ensures that the underlayer will be sufficiently contacted by metal balls during plating, guaranteeing consistent and sufficient plating layer thickness without complicating the plating process itself.
3Quantity of substance
If the plating layer thickness is insufficient or varies significantly, then material usage is reduced, but the direction identification accuracy deteriorates
Solution Approach 1:
The underlayer is selectively formed on a protruding portion at a specific location where contact with metal balls during electrolytic plating is needed. This localized approach ensures sufficient plating layer thickness only where necessary for direction identification, optimizing material usage while maintaining identification accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures reliable formation of thick plating layers with minimal variations, reducing errors in identifying the direction of multilayer electronic components and improving moisture resistance by maintaining insulation between the direction identification mark and ground electrodes.
Implementation Method 1
The direction identification mark is formed by electrolytically plating an underlayer with a Ni plating layer and a Sn plating layer. Electricity is supplied to the underlayer through the cathode, the metal balls, and the contacts between the metal balls and the underlayer.
Data Source
AI summary
A multilayer array electronic component includes a multilayer composite including a helical coil and a capacitor that are defined by stacking a coil conductor, a capacitor conductor, and a ceramic sheet on one another. External electrodes are arranged on the surface of the multilayer composite and electrically connected to the helical coil or the capacitor. A direction identification mark is arranged on the upper surface of the multilayer composite and electrically connected to any of the external electrodes through the helical coil or the capacitor.