Integrated Multi-Layer Metal Substrate for PV Optimizer Heat Dissipation
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Solution Overview
Problem
Conventional photovoltaic power optimizers face issues with low heat dissipation efficiency, complex structures, and high material costs due to thermal resistance and multiple discrete layers, which affect the performance and reliability of power devices.
Innovation Solution
A metal substrate heat dissipation structure with a multi-layer metal plate and PCB design that includes a first metal layer, insulation layers, and a second metal layer for electromagnetic shielding, reducing interface thermal resistance and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional discrete layers and multiple components are used for heat dissipation, then heat dissipation function is achieved, but structure becomes complex and manufacturing difficulty increases
Solution Approach 1:
The patent merges the PCB and metal substrate into a single integrated multi-layer structure. The PCB serves dual functions as both the circuit carrier and the heat dissipation substrate, eliminating the need for separate discrete heat dissipation components. This integration reduces structural complexity while maintaining effective heat dissipation through the metal layers embedded in the PCB.
Solution Approach 2:
The PCB is designed to perform multiple functions simultaneously: it provides electrical connections for control circuits, serves as the mounting substrate for power devices, and acts as the heat dissipation structure. The metal layers within the PCB provide both electrical grounding and thermal conduction paths, reducing the number of separate components needed.
2Reliability
If multiple discrete layers are used for heat dissipation, then heat dissipation capability is improved, but material costs increase
Solution Approach 1:
The patent combines multiple functions into the PCB structure itself, eliminating the need for separate heat dissipation components and reducing overall material requirements. The metal layers are integrated directly into the PCB manufacturing process rather than being added as separate discrete layers, reducing assembly steps and material costs.
Solution Approach 2:
The patent utilizes the existing PCB structure and its material properties (copper traces, aluminum substrate, insulation layers) to achieve heat dissipation functionality. By changing the functional assignment of existing PCB components rather than adding new materials, the solution maintains cost-effectiveness while improving heat dissipation capability.
3Productivity
If conventional heat dissipation structures are used, then power devices can operate, but interface thermal resistance is high and heat dissipation efficiency is low
Solution Approach 1:
The patent eliminates interfaces between separate heat dissipation components by integrating the heat dissipation function directly into the PCB structure. The power devices are mounted directly on the PCB with metal layers that provide continuous thermal conduction paths, reducing interface thermal resistance and improving heat dissipation efficiency.
Solution Approach 2:
The PCB itself serves as a composite heat dissipation structure, combining conductive metal layers (copper traces, aluminum substrate) with insulation layers in a single integrated component. This composite structure provides both electrical functionality and thermal conduction paths without requiring separate heat dissipation components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure improves heat dissipation efficiency, reduces material costs, and enhances the reliability and stability of power devices by utilizing a simple, flexible design that minimizes thermal resistance and simplifies assembly.
Implementation Method 1
The second metal layer has a strong heat dissipation capability, and may further enhance heat dissipation
Implementation Method 2
The second metal layer of the multi-layer metal plate may be connected to the static point on the first metal layer through sidewall soldering/tin plating or a via, to achieve shielding effect for noise feedback
Data Source
AI summary
A metal substrate heat dissipation structure and a photovoltaic power optimizer. The metal substrate heat dissipation structure includes a printed circuit board (PCB), a multi-layer metal plate, and a power device. The multi-layer metal plate includes a first metal layer, a second metal layer, a first insulation layer, and a second insulation layer. The power device is disposed on the first metal layer, to implement power interconnection between power devices. The PCB is electrically connected to the first metal layer, to enable a control device on the PCB to control the power device on the first metal layer. The first metal layer is electrically connected to the second metal layer, to implement an electromagnetic shielding function. The first insulation layer and the second insulation layer respectively implement functional insulation effect and reinforced insulation effect.