Multi-layer micro-wire substrate for transparent electrodes
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Solution Overview
Problem
Existing transparent conductive electrodes in display and touch-screen technologies face challenges with limited transparency, conductivity, and mechanical stress, along with high costs and difficulties in electrical connections for multi-layer micro-wire structures.
Innovation Solution
A multi-layer micro-wire structure is formed by imprinting micro-channels in multiple layers over a substrate, with exposed connection pads in each layer to facilitate improved electrical connectivity and reduced thickness, allowing for easier external connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If transparent conductive metal oxides are used to form electrodes, then transparency is improved, but electrical conductivity deteriorates
Solution Approach 1:
The patent uses a composite structure combining transparent conductive metal oxide layers with metal wire layers. The metal oxide layers (such as ITO) provide transparency, while the metal wires embedded in micro-channels provide high electrical conductivity. This composite approach allows the electrode to simultaneously achieve both high transparency and high conductivity that cannot be obtained with metal oxides alone.
2Reliability
If thicker layers of metal oxides or metals are used to increase conductivity, then electrical conductivity is improved, but transparency deteriorates
Solution Approach 1:
The electrode is segmented into multiple functional layers: thin transparent conductive metal oxide layers for transparency, and discrete metal wires positioned in micro-channels for conductivity. This segmentation allows each layer to be optimized independently - the metal oxide layers remain thin to maintain transparency while the metal wires provide the necessary conductivity without requiring thick continuous layers that would block light.
3Reliability
If micro-wires are formed in multiple layers on a single substrate, then electrical connectivity is improved, but device complexity increases
Solution Approach 1:
The patent transitions from planar two-dimensional electrode patterns to a three-dimensional multi-layer structure with micro-wires positioned at different heights and depths. Multiple layers of micro-wires are formed on a single substrate, creating vertical stacking that improves electrical connectivity and current distribution while managing the complexity through systematic layering rather than complex planar routing.
4Ease of manufacture
If conventional deposition processes are used for transparent conductive electrodes, then manufacturing is simplified, but current-carrying capacity is limited
Solution Approach 1:
The electrode structure combines transparent conductive metal oxides deposited by conventional processes (such as sputtering) with metal wires having superior current-carrying capacity. The metal oxide layers maintain ease of manufacture through standard deposition techniques, while the metal wires embedded in micro-channels provide the enhanced current-carrying capacity that cannot be achieved with metal oxides alone.
Data Source
AI summary
A method of making a multi-layer micro-wire structure includes providing a substrate having a substrate edge and first and second layers formed over the substrate. One or more micro-channels are imprinted in each of the first and second layers and first and second micro-wires located in the imprinted micro-channels, the micro-wires forming at least a portion of an exposed connection pad in each layer. The second layer edge is farther from the substrate edge than the first layer edge for at least a portion of the second layer edge so that the first connection pads are exposed through the second layer.