Multilayer Microchannel Structure for High-Aspect-Ratio Heat Transfer
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Solution Overview
Problem
Existing manufacturing processes for microchannel heat transfer devices, such as oscillating heat pipes, are costly and inefficient for producing deep-narrow channels with a high aspect ratio, which are essential for high heat flux applications.
Innovation Solution
A multilayer microchannel heat transfer device is fabricated by stacking and bonding multiple layers with shallow microchannels and/or slots, aligning them to form deep narrow composite microchannels with a high aspect ratio, thereby achieving the desired channel geometry at a lower cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If CNC milling is used to manufacture deep-narrow channels, then manufacturing precision and channel geometry are improved, but manufacturing cost increases significantly
Solution Approach 1:
The device is divided into multiple separate layers (first outer layer, second outer layer, and interstitial layers), each containing shallow microchannels. These layers are stacked and bonded together to form the final deep-narrow composite microchannels. This segmentation allows each layer to be manufactured using low-cost wet-etching processes rather than expensive CNC milling, while the stacked structure achieves the required deep channel geometry.
Solution Approach 2:
The invention transitions from creating deep channels in a single layer (one-dimensional depth problem) to stacking multiple layers with shallow channels (adding the layer dimension). By solving the channel depth problem through the vertical stacking of multiple shallow-channel layers, the patent avoids the high cost of single-step deep channel machining while achieving the same effective channel depth.
2Ease of manufacture
If wet-etching is used to manufacture microchannels, then manufacturing cost decreases, but channel depth and aspect ratio are insufficient
Solution Approach 1:
The total channel depth is segmented across multiple layers. Each layer contains a shallow microchannel that contributes a portion of the total depth. When layers are stacked and bonded, these shallow channels combine to form the complete deep channel structure, achieving high aspect ratio without requiring deep single-step etching.
Solution Approach 2:
The patent solves the depth limitation of wet-etching by adding the layer stacking dimension. Instead of etching deeply in one layer, the solution distributes the depth across multiple layers stacked in the vertical dimension, allowing wet-etching to create sufficiently deep composite channels while maintaining cost-effectiveness.
3Reliability
If channel width is reduced to increase the number of channels, then heat transfer efficiency is improved, but manufacturing difficulty and cost increase
Solution Approach 1:
The device is segmented into multiple layers, each containing a manageable number of shallow microchannels. This allows the use of standard wet-etching processes for each layer without requiring excessively precise alignment or manufacturing for ultra-narrow channels. The stacking process then combines these layers to achieve the high channel density needed for efficient heat transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the cost-effective manufacturing of microchannel devices with high aspect ratio channels, enhancing their heat transfer efficiency while maintaining structural integrity and hermeticity.
Implementation Method 1
The first outer layer, the second outer layer, and the at least one interstitial layer are stacked and bonded together having the one or more interstitial layer disposed between the first and second outer layer
Data Source
AI summary
A multilayer microchannel heat transfer device comprising a body having a first outer layer comprising at least one micro-sized first elongated recess, a second outer layer comprising at least one micro-sized second elongated recess, and at least one interstitial layer comprising at least one micro-sized elongated interstitial slot. The first outer layer, the second outer layer, and the interstitial layer(s) are stacked and bonded together having the interstitial layer(s) disposed between the first and second outer layer, whereby the first elongated recess(es), the second elongated recess(es) and the elongated interstitial slot(s) are aligned and combine to form at least one deep narrow composite microchannel having a high height to width aspect ratio internally disposed and enclosed within a resulting multilayer body.